Chip Industry Week In Review


The U.S. Department of Commerce and Amkor Technology signed a deal to provide up to $400 million in funding, under the CHIPS and Science Act, to build a previously announced end-to-end advanced packaging plant. The combined funding is expected to total about $2 billion. The new facility will add some 2,000 jobs in Peoria, Arizona. The SK hynix Board approved its Yongin Semiconductor Cluster... » read more

Chip Industry Week In Review


By Gregory Haley, Jesse Allen, and Liz Allan TSMC told equipment vendors to delay deliveries of the most advanced tools due to uncertain demand, according to Reuters. The news drove down stock prices of all the major equipment providers. On the other hand, TSMC said advanced packaging shortages will constrain AI chip shipments for the next 18 months, according to NikkeiAsia. The United St... » read more

Research Bits: Jan. 31


The power of proximity Researchers from Department of Energy’s Lawrence Berkeley National Laboratory (Berkeley Lab), Stanford, and University of California Berkeley have observed that electrons transfer heat rapidly between layers of the 2D semiconductor materials tungsten diselenide (WSe2) and tungsten disulfide (WS2). The electrons acted as a bridge between the two materials, the layers of... » read more

Manufacturing Bits: Feb. 7


Design tools for solid-state batteries Oak Ridge National Laboratory has devised a new tool designed to accelerate the development of energy-dense solid-state batteries. The tool, called the Solid-State Battery Performance Analyzer and Calculator (SolidPAC), enables researchers to assess the impact of battery designs and choice of cell components for solid-state batteries. It can be used to... » read more

Power/Performance Bits: Sept. 21


Catching switches in action Researchers from SLAC National Accelerator Laboratory, Stanford University, Hewlett Packard Labs, Penn State University, and Purdue University observed atoms moving inside an electronic switch as it turns on and off, revealing a state they suspect could lead to faster, more energy-efficient devices. "This research is a breakthrough in ultrafast technology and sci... » read more

Manufacturing Bits: Dec. 1


New phase-change materials The National Institute of Standards and Technology (NIST) has developed an open source machine learning algorithm for use in discovering and developing new materials. NIST’s technology, called CAMEO, has already been used by researchers to discover a new phase-change memory material. CAMEO, which stands for Closed-Loop Autonomous System for Materials Exploration... » read more

Manufacturing Bits: Sept. 15


World’s largest camera The Department of Energy’s SLAC National Accelerator Laboratory has taken a step towards the development of the world’s largest digital camera. Target for astronomy applications, SLAC has developed a large 3,200-megapixel sensor array and has taken its first photos with the system. The sensor array will be integrated into the world’s largest digital camera, wh... » read more

Power/Performance Bits: July 14


5G switches Researchers from the University of Texas at Austin and University of Lille built a new radio frequency switch that could save power in 5G devices when not actively jumping between different networks and spectrum frequencies. “It has become clear that the existing switches consume significant amounts of power, and that power consumed is useless power,” said Deji Akinwande, a ... » read more

Manufacturing Bits: Dec. 3


Microscopic movie star Using a 3D printer and a scanning electron microscope (SEM), a group has created a short animated film featuring the world’s smallest 3D figurine. The stop motion film, called Stardust Odyssey, features a 3D human-like figurine with a height of 300 microns, or close to the size of a grain of dust. This beat the previous record for the smallest figure in a film. N... » read more

System Bits: Sept. 3


Microprocessor built with carbon nanotubes Researchers at the Massachusetts Institute of Technology were able to design a microprocessor with carbon nanotubes and fabricate the chip with traditional processes, an advance that could be used in next-generation computers. Work on producing carbon nanotube field-effect transistors has gone on for some time. Fabricated at scale, those CNFETs oft... » read more

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