A new technical paper titled "Facilitating Small-Pitch Interconnects with Low-Temperature Solid-Liquid Interdiffusion Bonding" was published by researchers at Aalto University in Finland.
Abstract
"The trend for 3D heterogeneous integration drives the need for a low-temperature bonding process for high-density interconnects (HDI). The Cu-Sn-In based solid-liquid interdiffusion (SLID) is a p...
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