The Week In Review: Design

By Jesse Allen - 01 Sep, 2017 - Comments: 0

M&A Silvaco finalized its acquisition of SoC Solutions. The Georgia-based company was founded in 2000. Its team and portfolio of pre-configured IP subsystems and IoT/M2M IP will join Silvaco's IP group. Terms were not disclosed. Siemens PLM will acquire TASS International, a provider of simulation software, engineering and test services aimed primarily at the automotive industry. Based ... » read more

The Week In Review: Design

By Jesse Allen - 23 Jun, 2017 - Comments: 0

M&A Silvaco will acquire SoC Solutions, adding more IP experience to the company's portfolio. SoC Solutions, based in Atlanta, GA, focuses on pre-configured IP subsystems and IP targeting low power IoT and machine-to-machine communication. Terms of the deal were not disclosed, but the acquisition is expected to close soon. Imagination is putting the rest of the company up for sale after... » read more

The Week In Review: IoT

By Jeff Dorsch - 10 Jun, 2016 - Comments: 0

Design Automation Conference ARM Holdings announced that its DesignStart initiative to enable easy creation of chip designs using ARM Cortex-M0 intellectual property now takes in electronic design automation tools and design environments offered by Cadence Design Systems and Mentor Graphics. “Simplifying access to EDA tools from Cadence and Mentor Graphics will further spur rapid innovation,... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: SoC Solutions

The Week In Review: Design

The Week In Review: Design

The Week In Review: IoT