SONOS Non-Volatile Memory Technology

By Infineon - 07 Nov, 2024 - Comments: 0

The demand for embedded flash memory has grown steeply over the years as many new applications emerged in consumer electronics (touchscreens, smart cards, bank cards, mobile payment, e-passport, etc.) in addition to the industrial system-on-chip (SOC) designs. The memory content of these applications has been increasing steadily due to greater requirements on system performance and code/data st... » read more

L-FinFET Neuron For A Highly Scalable Capacitive Neural Network (KAIST)

By Technical Paper Link - 31 Oct, 2022 - Comments: 0

A new technical paper titled "An Artificial Neuron with a Leaky Fin-Shaped Field-Effect Transistor for a Highly Scalable Capacitive Neural Network" was published by researchers at KAIST (Korea Advanced Institute of Science and Technology). “In commercialized flash memory, tunnelling oxide prevents the trapped charges from escaping for better memory ability. In our proposed FinFET neuron, t... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 29 Dec, 2017 - Comments: 0

Chipmakers Christopher Rolland, an analyst at Susquehanna International, expects to see more merger and acquisition activity in the IC industry heading into 2018. “M&A activity slowed in 2017, but the year is going out with a bang!” Rolland said in a recent research note. Towards the end of 2017, for example, Broadcom made a bid for Qualcomm, while Marvell announced intent to buy Cavium. ... » read more

Drill Down: Embedded NVM Technology

By Ernest Worthman - 02 Apr, 2015 - Comments: 0

Many of the next-generation devices that will be seen on the IoT/E will have power, footprint, and electronic constraints as never before. Electronic flash memories (eFLASH), and their derivatives are seen as a realistic solution to many of these design constraints for small form factor and simple IoE devices. “NVM will be very important for the IoE from the perspective of saving power," ... » read more

Knowledge Centers
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Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

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Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

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The critical, and growing, significance of mature node chips and processes.

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Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

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Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

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Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

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Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: SONOS

SONOS Non-Volatile Memory Technology

L-FinFET Neuron For A Highly Scalable Capacitive Neural Network (KAIST)

The Week In Review: Manufacturing

Drill Down: Embedded NVM Technology

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