Exploring The 6G Spectrum Landscape

By Keysight - 27 Sep, 2023 - Comments: 0

In each generation of cellular communications, new spectrum has been key to delivering more services, more capacity, and higher data throughput to end users. 5G benefited from large contiguous bandwidths of millimeter-wave (mmWave) spectrum, known as frequency range 2 (FR2). And 5G benefited from the reallocation and unlocking of midband spectrum (3.4 to 4.9 GHz) with its more favorable propaga... » read more

Testing Millimeter Wave for 5G

By Susan Rambo - 05 Nov, 2018 - Comments: 0

By Susan Rambo and Ed Sperling The telecommunications world is hurtling toward 5G, but there is no consistency about how this next-gen wireless technology will be rolled out across various regions and plenty of unknowns about how it will be tested and how reliable it will be initially. A fair amount of confusion exists around what 5G constitutes in the first place. There is sub-6GHz 5G, w... » read more

Will 5G Deployment Lag in the U.S.?

By Jeff Dorsch - 08 Aug, 2018 - Comments: 0

China and other countries are creating “a 5G tsunami” that the U.S. will not be able to match unless it steps up its national investments in 5G cellular communications, Deloitte Consulting warns in a new report. The firm notes that China has outspent the U.S. on wireless communications infrastructure by $57 billion since 2015, constructing 350,000 new sites, compared with less than 2... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: spectrum

Exploring The 6G Spectrum Landscape

Testing Millimeter Wave for 5G

Will 5G Deployment Lag in the U.S.?