Week In Review: Manufacturing, Test

By Mark LaPedus - 13 Jul, 2018 - Comments: 0

Chipmakers GlobalFoundries said that the company’s 22nm FD-SOI technology has delivered more than $2 billion worth of client design win revenue. With more than 50 total client designs, the technology is designed for automotive, 5G connectivity and the Internet of Things (IoT). Helic has announced that its electromagnetic (EM) modeling engine has been certified for GlobalFoundries’ 22nm ... » read more

5G Test Equipment Race Begins

By Jeff Dorsch - 12 Jul, 2017 - Comments: 0

Test and measurement vendors stand ready to help with the development and deployment of 5G wireless communications, as the technology is fine-tuned and tested in trials around the world. Juniper Research forecasts 5G operator-billed service revenues will rise to $269 billion by 2025, compared with $851 million in 2019, for a compound annual growth rate of 161% during the first seven years of... » read more

Testing IoT Devices

By Jeff Dorsch - 05 Jun, 2017 - Comments: 3

Internet of Things devices present new challenges in testing. Some devices can be tested the same way as standard semiconductors are now tested, but others call for different approaches. Microcontrollers and other chips that go into safety-critical applications — medical devices, military/aerospace systems, and automotive electronics — need their own kind of testing to make sure they wil... » read more

Carriers Push Datacenter-Style Virtualization

By Gale Morrison - 01 Jun, 2017 - Comments: 0

The world’s largest telco carriers are leading a broad movement to bring data center-style virtualization to the core of their telecommunications networks. In an industry known for being extremely conservative when it comes to change, this one appears to be significant. The move has set off a scramble among a number of companies for unified control and forwarding plane designs, starting fr... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Spirent

Week In Review: Manufacturing, Test

5G Test Equipment Race Begins

Testing IoT Devices

Carriers Push Datacenter-Style Virtualization

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Entities, people and technologies explored