tag: Spreadtrum

Week in Review: IoT, Security, Auto
By Jeff Dorsch - 01 Mar, 2019 - Comments: 0

Internet of Things Yingzi Technology of Guangzhou, China, has developed a “future pig farm” to demonstrate what technology can do to make keeping pigs more profitable in a country that is trying to reduce the number of small farms raising pigs and consolidate them into larger operations. China is also contending with an outbreak of African swine fever that has spread out of the country thr... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 10 Nov, 2017 - Comments: 0

Packaging and test A*STAR’s Institute of Microelectronics (IME) has formed a fan-out wafer-level packaging consortium comprising of OSATs, materials vendors, equipment suppliers and others. The group is called the FOWLP Development Line Consortium. As part of the announcement, Singapore’s IME has established a development line to accelerate the development of fan-out. Located in IME’s... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 16 Jun, 2017 - Comments: 0

Chipmakers UMC has appointed two senior vice presidents--S.C. Chien and Jason Wang--as co-presidents of the company, following Po-Wen Yen’s retirement as UMC’s CEO. The co-presidents are accountable for the overall performance of UMC. They will report to UMC Chairman Stan Hung. Chien will focus on the core manufacturing and technology aspects of UMC, including R&D and operations. Wang wil... » read more

The Week In Review: Design
By Jesse Allen - 03 Mar, 2017 - Comments: 0

Legal Synopsys filed suit against Ubiquiti Networks and its project leader for "circumventing technological measures that effectively control access to Synopsys' software." The suit, filed in U.S. District Court in San Jose, claims that Ubiquiti used counterfeit keys obtained or created with tools from hacker websites to circumvent Synopsys' License Key system. Ubiquiti, based in San Jose, d... » read more

10nm Race Heats Up
By Mark LaPedus - 16 Aug, 2016 - Comments: 0

The 10nm process and foundry race is heating up, as Intel announced its 10nm technology at its annual conference. As part of the multi-pronged announcement, Intel’s foundry unit forged a major partnership with ARM. Specifically, ARM will make its physical intellectual-property (IP) available on Intel’s 10nm process. Intel, in turn, will offer the IP for foundry customers. And on to... » read more

What Will China Do Next?
By Ed Sperling - 26 May, 2016 - Comments: 0

China's attempts to buy up U.S. chip companies is undergoing more gyrations, this time spurred by the exchange rate set by the People's Bank of China and the U.S. Federal Reserve's expected interest rate hikes. The central bank dropped the exchange rate of the yuan versus the dollar to its lowest rate since 2011, according to Bloomberg. The current rate is now 6.55 yuan per dollar, compared ... » read more

The Week In Review: Design/IoT
By Jesse Allen - 26 Feb, 2016 - Comments: 0

Tools Synopsys incorporated automated analog and mixed-signal debug capabilities into its Verdi SoC debug platform, which now provides comprehensive hierarchical and schematic views of both the analog and digital portions of designs and automated tracing across analog and digital blocks. Mentor announced three applications for the Veloce emulation platform focused on overcoming unpredicta... » read more

China’s Impact On The Semiconductor Market
By Bob Smith - 08 Feb, 2016 - Comments: 2

China’s impact on the semiconductor market is unmistakable. The question so many industry watchers wonder: Is it the new center of the semiconductor universe? Some statistics may help determine the answer. China topped the list of five worldwide exporters in 2014, with the European Union coming in second. The U.S. finished third, followed by Germany and, in fifth place, Japan. (See Fig. 1... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 29 Jan, 2016 - Comments: 0

Qualcomm recently announced the new Snapdragon 820. The cell-phone chipset is based on Samsung Electronics’ new 14nm LPP (Low-Power Plus) process, the second-generation of the company’s 14nm finFET process technology. What’s next? Qualcomm is developing the Snapdragon 830. “Snapdragon 830 leaks indicate that the chip will sport 8GB of RAM, an enhanced Kryo custom architecture, and fabbe... » read more

The Week In Review: Design/IoT
By Jesse Allen - 04 Dec, 2015 - Comments: 0

Tools Cadence uncorked the next generation of its custom design platform optimized for advanced 10nm FinFET designs. Features include multi-patterning and color-aware layout, electrically aware design, and module generator (ModGen)-based device array flow. Deals San'an IC will provide Mentor Graphics' design rule decks to its customers to help verify that their mobile and wireless gall... » read more

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