Toward A 5G, AI-Centric World

By Sundeep Bajikar - 19 Apr, 2018 - Comments: 0

The market environment over the coming years will continue to experience an explosion of data generation from a variety of new sources such as smart cars, smart factories, smart hospitals and smart network infrastructure. Data explosion combined with artificial intelligence (AI) will create a renaissance of computing and storage hardware. Mobile World Congress 2018 (MWC) reinforced this market ... » read more

The Week In Review: IoT

By Jeff Dorsch - 16 Jun, 2017 - Comments: 0

Market Research International Data Corp. updated its Worldwide Semiannual Internet of Things Spending Guide, forecasting global IoT spending will increase 16.7% this year to more than $800 billion. The market research firm says the market will grow to almost $1.4 trillion by 2021. Manufacturing, smart grid technologies, freight monitoring, production asset management, and smart building techno... » read more

The Week in Review: IoT

By Jeff Dorsch - 22 Jul, 2016 - Comments: 0

Deals The big news of the week, of course, is SoftBank Group’s proposed acquisition of ARM Holdings for a breathtaking $32.2 billion in cash. In announcing the deal, the companies made it abundantly clear that the proposed acquisition is chiefly about Internet of Things technology. “When I think about the investment and the commitment that’s going to be required to develop the future te... » read more

Inside The 5G Smartphone

By Mark LaPedus - 20 Aug, 2015 - Comments: 3

Amid a slowdown in the cell phone business, the market is heating up for perhaps the next big thing in wireless—5th generation mobile networks or 5G. In fact, major carriers, chipmakers and telecom equipment vendors are all rushing to get a piece of the action in 5G, which is the follow-on to the current wireless standard known as 4G or long-term evolution (LTE). Intel, Samsung and Qualcom... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Sprint

Toward A 5G, AI-Centric World

The Week In Review: IoT

The Week in Review: IoT

Inside The 5G Smartphone