A Collaborative Data Model For AI/ML In EDA

By Si2 - 21 Dec, 2020 - Comments: 0

This work explores industry perspectives on: Machine Learning and IC Design Demand for Data Structure of a Data Model A Unified Data Model: Digital and Analog examples Definition and Characteristics of Derived Data for ML Applications Need for IP Protection Unique Requirements for Inferencing Models Key Analysis Domains Conclusions and Proposed Future Work Abstra... » read more

Digital Test Bulks Up – Or Down

By Bryon Moyer - 08 Dec, 2020 - Comments: 2

Large digital integrated circuits are becoming harder to test in a time- and cost-efficient manner. AI chips, in particular, have tiled architectures that are putting pressure on older testing strategies due to the volume of test vectors required. In some cases, these chips are so large that they exceed reticle size, requiring them to be stitched together. New testing efficiencies are needed... » read more

Learning ISO 26262 – 2nd Edition

By Kurt Shuler - 07 Dec, 2020 - Comments: 0

You might think that when you get into a debate with a customer or a supplier about the exact interpretation of some aspect of ISO 26262, all you have to do is go to the standard, look it up, and there’s the answer you all need, plain as day. That would be ideal but often doesn’t reflect reality. To realize why, you have to understand the background to the standard. A short ISO 26262 o... » read more

Uniquely Identifying PCBs, Subassemblies, And Packaging

By Bryon Moyer - 18 Nov, 2020 - Comments: 0

Securing the semiconductor supply chain is becoming much more difficult as devices increasingly are disaggregated, a shift being forced on the industry due to the rising cost of scaling and the need for more customization and faster time to market. Individual component IDs are an important starting point for supply chain trust, but they are no longer sufficient. Those components will end up ... » read more

Design For Manufacturing Best Practices

By Josh Akman - 12 Nov, 2020 - Comments: 0

Manufacturing issues are one of the top reasons that we see warranty returns and loss of market share in the electronics industry. Issues like supply chain failures and printed circuit board assembly (PCBA) production challenges related to design can lead to irreparable damage to a brand’s reputation. It is therefore critical that companies have a design for manufacturability (DfM) protocol i... » read more

112G SerDes Reliability

By Ed Sperling - 05 Oct, 2020 - Comments: 0

Priyank Shukla, product marketing manager at Synopsys, digs into 112Gbps SerDes, why it’s important to examine the performance of these devices in the context of a system, what is acceptable channel loss, and how density can affect performance, power and noise. » read more

Industry Pushes For Fab Tool Security Standards

By Mark LaPedus - 17 Sep, 2020 - Comments: 1

The semiconductor industry is developing new cybersecurity standards for fab equipment in an effort to protect systems from potential cyberattacks, viruses, and IP theft. Two new standards are in the works, which are being formulated under the auspices of the SEMI trade group with leadership from chipmakers and others. Led by Intel and Cimetrix, the first standard deals with malware-free equ... » read more

Wireless Power Market Heats Up

By Bryon Moyer - 26 Aug, 2020 - Comments: 2

The wireless power market is in flux as established technologies meet newer approaches. Old standards battles have simmered somewhat, but competing messages remain. What the public ends up using will depend heavily on public charging infrastructure, but the stakes are significant. The market for battery chargers is forecast to reach $25B by 2022. Most of those chargers plug into the wall, bu... » read more

Accellera Tackles Functional Safety

By Paul McLellan - 06 Aug, 2020 - Comments: 0

During DAC, Accellera had a workshop about functional safety. In case you don't know, Accellera has a relatively new working group (WG) on Functional Safety. The chair is Cadence's Alessandra Nardi, who coincidentally also received the Marie Pistilli Award for Women in EDA during DAC (you can read more about that in my post Alessandra Nardi Receives Marie Pistilli Award for Women in EDA). But ... » read more

Universal Verification Methodology Running Out Of Steam

By Ann Mutschler - 30 Jul, 2020 - Comments: 2

For the past decade or so, the Universal Verification Methodology (UVM) has been the de facto verification methodology supported by the entire EDA industry. But as chips become more heterogeneous, more complex, and significantly larger, UVM is running out of steam. Consensus is building that some fundamental changes are required, moving tools up a level of abstraction and making them more ag... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: standards