tag: standards

Aging Analysis Common Model Interface Gains Momentum
By Greg Curtis - 25 Mar, 2021 - Comments: 0

By Greg Curtis, Ahmed Ramadan, Ninad Pimparkar, and Jung-Suk Goo In February 2019, Siemens EDA wrote an article1 entitled “The Time Is Now for a Common Model Interface”. Since that time, we have continued to see increasing demand for aging analysis, not only in the traditional automotive space, but also in other areas of technology design, such as mobile communication and IoT application... » read more

Chiplets For The Masses
By Brian Bailey - 03 Mar, 2021 - Comments: 2

Chiplets are a compelling technology, but so far they are available only to a select few players in the industry. That's changing, and the industry has taken little steps to get there, but timing for when you will be able to buy a chiplet to integrate into your system remains uncertain. While new fabrication nodes continue to be developed, scaling is coming to an end, be it for physical or e... » read more

Predicting And Avoiding Failures In Automotive Chips
By Ed Sperling - 02 Mar, 2021 - Comments: 0

Semiconductor Engineering sat down to discuss automotive electronics reliability with Jay Rathert, senior director of strategic collaborations at KLA; Dennis Ciplickas, vice president of advanced solutions at PDF Solutions; Uzi Baruch, vice president and general manager of the automotive business unit at OptimalPlus; Gal Carmel, general manager of proteanTecs' Automotive Division; Andre van de ... » read more

The Many Flavors Of UPF: Which Is Right For Your Design?
By Madhur Bhargava - 11 Feb, 2021 - Comments: 0

Energy efficient electronic systems require sophisticated power management architectures that present difficult low-power verification challenges. Accellera introduced the Unified Power Format (UPF) standard in 2007 to help engineers deal with these complex issues. To keep pace with the growing complexity of low-power designs, the UPF standard has itself continued to evolve through the relea... » read more

Improving Automotive Electronic Hardware With SAE J3168
By Theresa Duncan - 14 Jan, 2021 - Comments: 0

By Theresa Duncan and Craig Hillman The race is on for fully autonomous vehicles. Industry giants like Tesla, Google, Uber and almost all major automotive companies are competing to deliver state-of-the-art self-driving vehicles. However, the development of new, cutting-edge technologies demands a similar wave of reliability, repairability and warranty standards that automotive manufactur... » read more

Electronics Supply-Chain Trust Standards Emerge
By Bryon Moyer - 07 Jan, 2021 - Comments: 0

Creative new ideas for electronics supply-chain trust are in rich supply, whether securing identity, protecting logistics, or establishing provenance. But underlying these efforts are wide-ranging standards in development from a broad set of organizations. Today, no one-stop-shop for supply-chain standards exists. Instead, there is huge fragmentation. It can be difficult to identify all of t... » read more

A Collaborative Data Model For AI/ML In EDA
By Si2 - 21 Dec, 2020 - Comments: 0

This work explores industry perspectives on: Machine Learning and IC Design Demand for Data Structure of a Data Model A Unified Data Model: Digital and Analog examples Definition and Characteristics of Derived Data for ML Applications Need for IP Protection Unique Requirements for Inferencing Models Key Analysis Domains Conclusions and Proposed Future Work Abstra... » read more

Digital Test Bulks Up – Or Down
By Bryon Moyer - 08 Dec, 2020 - Comments: 2

Large digital integrated circuits are becoming harder to test in a time- and cost-efficient manner. AI chips, in particular, have tiled architectures that are putting pressure on older testing strategies due to the volume of test vectors required. In some cases, these chips are so large that they exceed reticle size, requiring them to be stitched together. New testing efficiencies are needed... » read more

Learning ISO 26262 – 2nd Edition
By Kurt Shuler - 07 Dec, 2020 - Comments: 0

You might think that when you get into a debate with a customer or a supplier about the exact interpretation of some aspect of ISO 26262, all you have to do is go to the standard, look it up, and there’s the answer you all need, plain as day. That would be ideal but often doesn’t reflect reality. To realize why, you have to understand the background to the standard. A short ISO 26262 o... » read more

Uniquely Identifying PCBs, Subassemblies, And Packaging
By Bryon Moyer - 18 Nov, 2020 - Comments: 0

Securing the semiconductor supply chain is becoming much more difficult as devices increasingly are disaggregated, a shift being forced on the industry due to the rising cost of scaling and the need for more customization and faster time to market. Individual component IDs are an important starting point for supply chain trust, but they are no longer sufficient. Those components will end up ... » read more

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