tag: Strategy Analytics

Week In Review: Manufacturing, Test
By Mark LaPedus - 29 Nov, 2019 - Comments: 0

Packaging and test TrendForce has released its top-10 OSAT rankings in terms of sales for the third quarter of 2019. ASE was in first place in the rankings, followed by Amkor and JCET. “According to the latest research from TrendForce, the decline in the global OSAT industry showed signs of a gradual halt in 3Q19, since the drop in memory prices began to slow down, and smartphone sales stead... » read more

Week In Review: IoT, Security, Automotive
By Susan Rambo - 22 Nov, 2019 - Comments: 0

Automotive Porsche’s electric race car, the 99X Electric, used ANSYS Technology’s system-level simulation solutions to create an advanced electric powertrain. The powertrain is also being adapted for use in Porsche’s consumer electric cars. "ANSYS system-level simulations are instrumental for optimizing the Porsche E-Performance Powertrain's motor, gearbox, power electronics and control ... » read more

RF GaN Gains Steam
By Mark LaPedus - 21 Nov, 2019 - Comments: 0

Wide-bandgap semiconductors are hot topics these days. One wide-bandgap semi type--silicon carbide (SiC)--is the talk of the town and is gaining steam in electric vehicles and other systems. But let’s not forget about gallium nitride (GaN). GaN, a binary III-V material, has 10 times the breakdown field strength with double the electron mobility than silicon. GaN is used for LEDs, power ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 15 Nov, 2019 - Comments: 0

Market research Smartphone shipments in China stood at 98.9 million units in the third quarter of 2019, down 3.6% year-on-year, according to IDC. Of that, 5G phone shipments in China have grown from virtually zero not long ago to 485,000 units in the third quarter of 2019, according to IDC. Vendors shipped devices amid the launch of commercial 5G services in October. The early smartphone le... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 18 Oct, 2019 - Comments: 0

Chipmakers The semiconductor capital spending race continues to escalate in the leading-edge logic space. Intel and Samsung have separately announced big capital spending plans in 2019. Intel’s latest CapEx budget is $15.5 billion in 2019, while Samsung’s CapEx is slated for $16.204 billion for the year, according to KeyBanc Capital Markets. Now, TSMC is raising the stakes. TSMC this... » read more

Autonomous Vehicles Are Reshaping The Tech World
By Kevin Fogarty - 05 Sep, 2019 - Comments: 0

The effort to build cars that can drive themselves is reshaping the automotive industry and its supply chain, impacting everything from who defines safety to how to ensure quality and reliability. Automakers, which hardly knew the names of their silicon suppliers a couple of years ago, are now banding together in small groups to share the costs and solve technical challenges that are well be... » read more

How Many Test Miles Make A Vehicle Safe?
By Kevin Fogarty - 06 Aug, 2019 - Comments: 0

The road to reliable safety testing of autonomous vehicles (AVs) is shifting left. Standards groups are beginning to publish functional safety standards that could make it possible to verify what a machine-learning AV pilot application will do in a traffic situation even before hardware or software is released from validation testing. This kind of approach has been possible for some time in ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 02 Aug, 2019 - Comments: 0

Trade wars Talks between the United States and China continue to stall and the two nations are still embroiled in a trade war. So this week, U.S. President Donald Trump would like to impose a 10% tariff on the remaining $300 billion list of China-based imports starting Sept. 1, according to a report from Reuters. This in turn will impact the electronics and IC industries. In response to the... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 19 Jul, 2019 - Comments: 0

Chipmakers TSMC posted mixed results for the second quarter. It also presented a mixed outlook for the third quarter, according to various reports. TSMC and Samsung are in the midst of a foundry battle at 7nm and 5nm. “TSMC raised its 2019 capex outlook to over $11B, up from prior guidance of $10B-$11B. The increased capex is to support 5nm and 7nm ramps, with accelerated 5G investment a... » read more

Challenges Grow For 5G Packages And Modules
By Mark LaPedus - 18 Jul, 2019 - Comments: 0

The shift to 5G wireless networks is driving a need for new IC packages and modules in smartphones and other systems, but this move is turning out to be harder than it looks. For one thing, the IC packages and RF modules for 5G phones are more complex and expensive than today's devices, and that gap will grow significantly in the second phase of 5G. In addition, 5G devices will require an as... » read more

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