Survey: 2023 eBeam Initiative Luminaries Survey Results

By eBeam Initiative - 18 Oct, 2023 - Comments: 0

Luminaries are confident in high-NA EUV and curvilinear masks 12th Annual Luminaries Survey — July 2023 • Luminaries remain confident in broad High-NA EUV adoption by 2028 • Confidence doubled in leading-edge mask shops handling curvilinear mask demand • Curvilinear masks aren’t just for EUV • Luminaries are more confident about 2023 mask revenues than SEMI Click here to rea... » read more

A Survey of Network-Based Hardware Accelerators

By Technical Paper Link - 18 Apr, 2022 - Comments: 0

Abstract "Many practical data-processing algorithms fail to execute efficiently on general-purpose CPUs (Central Processing Units) due to the sequential matter of their operations and memory bandwidth limitations. To achieve desired performance levels, reconfigurable (FPGA (Field-Programmable Gate Array)-based) hardware accelerators are frequently explored that permit the processing units’ a... » read more

Survey: 2022 Deep Learning Applications

By eBeam Initiative - 16 Mar, 2022 - Comments: 0

The 2022 member list of deep learning projects and products that eBeam members are working on in photomask to wafer semiconductor manufacturing. Participating companies include Advantest, ASML, Canon, CEA-LETI, D2S, Fraunhofer IPMS, Hitachi High-Tech Corporation, imec, NuFlare Technology, Siemens Industries Software, Inc.; Siemens EDA, STMicroelectronics, and TASMIT. Click here to see the su... » read more

Survey: 2020 eBeam Initiative Annual Survey Results

By eBeam Initiative - 21 Jul, 2021 - Comments: 0

Aki Fujimura, the CEO of D2S, Inc. presented "The eBeam Initiative's Annual Survey Results at Photomask" at Photomask Japan 2021 in April 2021. Survey says that COVID has a net neutral business impact on total mask revenues. By 2021, 24% positive vs 20% negative COVID-related business predictions. 74% agree actinic inspection for EUV HVM by 2023, and more results. Click here to read more. » read more

Survey: 2019 eBeam Initiative Perceptions Survey Results

By eBeam Initiative - 16 Sep, 2020 - Comments: 0

Results of the 2020 eBeam Initiative Perceptions survey, now called the Luminaries survey, will be made available starting on September 22 here: Meanwhile, here is the 8th Annual Perceptions Survey – 2019 (July). 68 luminaries across 42 different companies participated. Some highlights: Deep learning impact predicted by 2020: 76% of the respondents say it’s somewhat to very lik... » read more

And The Survey Says…

By Brian Bailey - 25 Jun, 2020 - Comments: 0

Some of you may have received an email recently that looks something like this. Others may be getting it in a little while. This is an invitation to participate in a survey that is important for the industry, and I encourage you not to ignore it. Let me explain a little. This survey has quite a long history. It all started in 2002 when Collett International conducted the first survey. Ba... » read more

The 2016 Wilson Research Group Functional Verification Study

By Harry Foster - 08 Sep, 2016 - Comments: 0

I am writing a series of blogs that presents the findings from our new 2016 Wilson Research Group Functional Verification Study. Similar to my previous 2014 Wilson Research Group functional verification study blogs, I plan to begin this set of blogs with an exclusive focus on FPGA trends. Why? For the following reasons: Some of the more interesting trends in our 2016 study are related to F... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer