The Week In Review: Design

By Jesse Allen - 20 Apr, 2018 - Comments: 0

M&A The ESD Alliance is merging with SEMI, becoming a SEMI Strategic Association Partner. SE Editor In Chief Ed Sperling argues that the merger has broad implications for the chip industry, particularly as smaller nodes require greater collaboration between design and manufacturing. Meanwhile, SEMI president and CEO Ajit Manocha explains why the combining will be of benefit to members of b... » read more

Constructing The Pillars Of The ARM HPC Ecosystem

By Darren Cepulis - 22 Nov, 2016 - Comments: 0

In talking with HPC users at SC15 following the announcement of the OpenHPC project, I consistently heard that while they valued having a common open source framework covering a baseline set of HPC codes, they wanted to see more than one chip architecture represented. This is important when you consider that many HPC users are focused on getting to exascale computing for future supercomputer de... » read more

The Week In Review: System-Level Design

By Ed Sperling - 31 Jan, 2014 - Comments: 0

ARM and its ecosystem teamed up to create a server platform standard based on the ARMv8-A processor. The new Server Base System Architecture specification leverages a broad swath of companies in ARM’s ecosystem, including Microsoft, Red Hat, SUSE, Linaro, Citrix, AMD, Broadcom, Citrix and Cavium, as well as OEMs HP and Dell. ARM has been successful in leveraging an ecosystem to win the lion�... » read more

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Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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The Week In Review: Design

Constructing The Pillars Of The ARM HPC Ecosystem

The Week In Review: System-Level Design

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