Week In Review: Auto, Security, Pervasive Computing

By Marie C. Baca - 27 Jan, 2023 - Comments: 0

The U.S. Department of Defense updated the directive that governs the development and fielding of autonomous and semi-autonomous weapon systems. The revisions include an expanded focus on artificial intelligence, and reference to recently-established organizations like the DoD’s Chief Digital and Artificial Intelligence Office. NIST released a new guidance document aimed at helping organi... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 18 Nov, 2022 - Comments: 0

Automotive, mobility Infineon has a non-binding Memorandum of Understanding to supply automaker Stellantis with CoolSiC “bare die” chips by reserving manufacturing capacity in the second half of the decade to the direct Tier 1 suppliers of Stellantis. CoolSiCs are Infineon’s silicon carbide (SiC) semiconductors. Stellantis will acquire aiMotive, a startup specializing in AI and autono... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 03 Sep, 2021 - Comments: 1

OEMs For some time, the automotive industry has suffered due to chip shortages in the market. And the chip shortages are spreading into other markets. In the latest news, GM plans to idle key truck plants amid chip shortages, according to a report from Bloomberg. “GM said eight of its 14 North American assembly plants will experience shutdowns this month because of chip shortages, includi... » read more

IoT’s Potential In Japan

By Joanne Itow - 11 Dec, 2014 - Comments: 0

Going to Semicon Japan was a real treat this year. The event was held at a new location, the weather was sunny, and the exhibits/presentations were engaging. During my walks around the exhibit floor I was drawn to the metrology and material characterization tools. Those booths seemed to have the most interesting information to share. Talking with companies like Rigaku provided insight into the ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Suzuki

Week In Review: Auto, Security, Pervasive Computing

Week In Review: Auto, Security, Pervasive Computing

Week In Review: Manufacturing, Test

IoT’s Potential In Japan