Blog Review: June 19

By Jesse Allen - 19 Jun, 2024 - Comments: 0

Siemens' John McMillan and Todd Burkholder suggest using an automatic formal-based approach to verifying chiplet package connections early in the design process. Cadence's Veena Parthan explores the intricacies of wind tunnel testing in automotive design and how the collaborative relationship between computational fluid dynamics (CFD) and wind tunnels has resulted in accelerated and more nua... » read more

What’s Missing In Test

By Anne Meixner - 19 Jun, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss how functional test content is brought up at first silicon, and the balance between ATE and system-level testing, with Klaus-Dieter Hilliges, V93000 platform extension manager at Advantest Europe; Robert Cavagnaro, fellow in the Design Engineering Group at Intel (responsible for manufacturing and test strategy of data center... » read more

IC Industry’s Growing Role In Sustainability

By Ann Mutschler - 17 Jun, 2024 - Comments: 1

The massive power needs of AI systems are putting a spotlight on sustainability in the semiconductor ecosystem. The chip industry needs to be able to produce more efficient and lower-power semiconductors. But demands for increased processing speed are rising with the widespread use of large language models and the overall increase in the amount of data that needs to be processed. Gartner estima... » read more

Chip Industry Week In Review

By The SE Staff - 14 Jun, 2024 - Comments: 0

Samsung unveiled its latest 2nm and 4nm process nodes, plus its AI solutions during the Samsung Foundry Forum. The company also introduced an aggressive roadmap for the next few years that includes 3D-ICs with logic-on-logic, starting in 2025; custom HBM with built-in logic; backside power delivery on 2nm technology in 2027; and co-packaged optics. In presentations at the event, the company als... » read more

Why PCIe 7.0 Over Optics

By Keivan Javadi Khasraghi - 13 Jun, 2024 - Comments: 0

By Keivan Javadi Khasraghi and Ruben Sousa Data centers are currently facing the increasing need to enhance their bandwidth capacities. This surge is largely driven by the rise of new technologies, especially the growing demand for AI and machine learning applications. As these technologies advance, bandwidth requirements are projected to expand dramatically. As Large Language Models (LLMs) ... » read more

When To Expect Domain-Specific AI Chips

By Brian Bailey - 13 Jun, 2024 - Comments: 0

The chip industry is moving toward domain-specific computation, while artificial intelligence (AI) is moving in the opposite direction, creating a gap that could force significant changes in how chips and systems are architected in the future. Behind this split is the amount of time it takes to design hardware and software. In the 18 months since ChatGPT was launched on the world, there has ... » read more

Big Shift: Creating Automotive SW Without HW

By Ann Mutschler - 12 Jun, 2024 - Comments: 1

Experts at the Table: The automotive ecosystem is undergoing a transformation toward software-defined vehicles, spurring new architectures with more software. Semiconductor Engineering sat down to discuss the impact of these changes with Suraj Gajendra, vice president of products and solutions in Arm's automotive line of business; Chuck Alpert, R&D automotive fellow at Cadence; Steve Spadon... » read more

Blog Review: June 12

By Jesse Allen - 12 Jun, 2024 - Comments: 0

Cadence's Deep Mehta finds that PCIe 6.0 switches need advanced verification strategies that delve deeper than basic functionality, such as generating backpressure traffic to identify potential performance bottlenecks and ensure the switch operates optimally in real-world scenarios. Siemens' Reetika explains why proper management and verification of reset domain crossing (RDC) paths are cruc... » read more

Testing PCI Express 5.0 PHY Transmitter Performance Without Analysis Software

By Synopsys - 12 Jun, 2024 - Comments: 0

PCI Express (PCIe) 5.0 silicon characterization across process, voltage, and temperature variations, is necessary for accelerating SoC designs. To measure key qualifying parameters, designers and test engineers must have a good understanding of the PCIe 5.0 base electrical specification and know the physical layer’s design architecture and features for accurate characterization of 32GT/s PHY ... » read more

Automotive Electronics Reliability Requires In-Field Silicon Monitoring

By Lorin Kennedy - 11 Jun, 2024 - Comments: 1

By Lorin Kennedy and Dan Alexandrescu For everyday consumers, no products require reliability more than automobiles. While consumers may be willing accept their laptops and phones limiting performance or abruptly turning off when systems reach unacceptable temperature levels, that is not the case for the reliability of Advanced Driver-Assistance Systems (ADAS) or other safety critical system... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.