tag: Synopsys

The Proliferation Of Bluetooth In V2X Automotive Applications
By Charles Dittmer - 01 Feb, 2024 - Comments: 0

V2X, or “Vehicle to Everything,” applies to wireless communication between a vehicle and a specific entity or network. Although vehicle-to-vehicle communication projects can be traced back to the 1970s, more recently the IEEE WLAN V2X specifications released in 2010 and the 3GPP V2X specification published in 2016 have defined specific wireless standards for V2X communications. Most of the ... » read more

Formal Verification’s Usefulness Widens
By Ann Mutschler - 31 Jan, 2024 - Comments: 0

Formal verification is being deployed more often and in more places in chip designs as the number of possible interactions grows, and as those chips are used in more critical applications. In the past, much of formal verification was focused on whether a chip would function properly. But as designs become more complex and heterogeneous, and as use cases change, formal verification is being u... » read more

Blog Review: Jan. 31
By Jesse Allen - 31 Jan, 2024 - Comments: 0

Synopsys' William Ruby argues for a comprehensive energy-efficient design methodology for automotive ICs as today's vehicles demand ever more computing power to support electrification, communication, and processing of massive amounts of data. Cadence's Mellacheruvu Srikanth finds that verifying all the new features and enhancements across several generations of PCIe while maintaining backwa... » read more

Meeting Stringent PA_SaveConfigTime In UFS Solution When M-PHY Needs Higher Reconfigure Time
By Synopsys - 31 Jan, 2024 - Comments: 0

The JEDEC Universal Flash Storage (UFS) has emerged as the default mobile storage solution for high-end smartphones and battery-operated devices, owing to its superior speed, performance, and power efficiency. These attributes are essential to meet users' demand for rapid transmission and reception of high-resolution media amid myriad operations. Despite these advantages, UFS's use of the MIPI ... » read more

Why There Are Still No Commercial 3D-ICs
By Brian Bailey - 29 Jan, 2024 - Comments: 0

Building chips in three dimensions is drawing increased attention and investment, but so far there have been no announcements about commercial 3D-IC chips. There are some fundamental problems that must be overcome and new tools that need to be developed. In contrast, the semiconductor industry is becoming fairly comfortable with 2.5D integration, where individual dies are assembled on some k... » read more

EDA Back On Investors’ Radar
By Brian Bailey - 25 Jan, 2024 - Comments: 0

EDA is transforming from a staid but strategic sector into a hot investment market, fueled by strong earnings and growth, a clamoring for leading-edge and increasingly customized designs across new and existing markets, and the rollout of advanced technologies such as AI for a range of tools that will be needed to develop new architectures with much greater performance per watt. A confluence... » read more

IC Tool Vendors Eye Cloud-Native Future
By Aharon Etengoff - 25 Jan, 2024 - Comments: 0

The promise of scalability and efficiency is accelerating the migration of electronic design automation (EDA) to the cloud. Unlimited on-demand compute resources fundamentally change the chip design paradigm, where tools and workloads are no longer constrained by localized hardware. This is easier said than done, however. Optimizing existing tools and infrastructure, creating a new generatio... » read more

Shifting Left Using Model-Based Engineering
By Karen Heyman - 25 Jan, 2024 - Comments: 0

As heterogenous integration increases design complexity and forces engineers out of long-standing silos, model-based systems engineering (MBSE) is becoming essential for improving quality and reducing failures in the field. While it may seem like a new buzzword, MBSE's principles date back to the 1990s. In essence, it's a process of building models that enable early decisions, which pays off... » read more

Why Is The Power Device Market So Hot Right Now?
By Dermott Lynch - 25 Jan, 2024 - Comments: 0

Growing adoption of electric vehicles (EVs) and renewable energy sources is putting the spotlight on power semiconductor devices. These power devices have always been essential in determining the efficiency of a variety of systems, from small household electronics to equipment used in outer space. But as calls to reduce carbon emissions get louder, the market for these chips continues to flouri... » read more

Fan-Out Panel-Level Packaging Hurdles
By Anne Meixner - 24 Jan, 2024 - Comments: 0

Fan-out panel-level packaging (FOPLP) promises to significantly lower assembly costs over fan-out wafer-level packaging, providing the relevant processes for die placement, molding and redistribution layers (RDLs) formation can be scaled up with equivalent yield. There is still much work to be done before that happens. Until now, FOPLP has been adopted for devices that are manufactured in ve... » read more

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