DAC 2018: System Design, Cloud And Machine Learning

By Frank Schirrmeister - 28 Jun, 2018 - Comments: 0

This marks the 10th DAC that I have covered as a blogger. At DAC 2008 in Anaheim, the industry had just come together behind the SystemC TLM 2.0 standard to enable virtual platforms, finally getting to model interoperability. System design is the common thread that is also present in this year’s DAC in 2018 in San Francisco. But a lot has changed. Big data analytics, artificial intelligence a... » read more

Tuesday At DAC 2018

By Brian Bailey - 27 Jun, 2018 - Comments: 0

The morning starts with the Accellera Breakfast. Accellera has made some significant progress this year and we can expect to hear about the approval of the Portable Stimulus 1.0 specification later in the conference as well as the initial release of SystemC CCI as well as a proposal for the creation of an IP Security Assurance Working Group, which will discuss standards development to address s... » read more

The Week In Review: Design

By Jesse Allen - 15 Jun, 2018 - Comments: 0

M&A MIPS has reportedly been acquired again, this time by AI startup Wave Computing. Wave focuses on data center-based neural network training using its parallel dataflow processing architecture. In March, the company signed on to use 64-bit multi-threaded processor cores from MIPS in future projects. Previously, MIPS was owned by Tallwood Venture Capital, which acquired MIPS from Imaginat... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: SystemC CCI

DAC 2018: System Design, Cloud And Machine Learning

Tuesday At DAC 2018

The Week In Review: Design