Ray Zinn Reflects On 37 Years As CEO Of Micrel

By Brian Bailey - 26 May, 2016 - Comments: 0

Believed to be the longest serving CEO of any company to have existed in Silicon Valley, Ray Zinn does more in retirement than many people would accomplish as full time employees. While his name may not be at the top of most influential people in the valley, the industry may not be the same today had it not been for his contributions. Semiconductor Engineering spoke with him about his past, the... » read more

Consolidation Hits OSAT Biz

By Mark LaPedus - 18 Feb, 2016 - Comments: 0

The outsourced semiconductor assembly and test (OSAT) industry is undergoing a new wave of acquisition activity that will dramatically reshape the packaging and test services markets. [getkc id="83" kc_name="OSATs"] have seen a considerable amount of consolidation over the years, but the industry needs a scorecard to keep track of the recent deals and the resulting fallout. One OSAT deal inv... » read more

10nm Fab Watch

By Mark LaPedus - 21 May, 2015 - Comments: 1

When will the 10nm logic node happen? Analysts believe that foundry vendors will move into 10nm finFET volume production around 2017. Still others say the 10nm finFET ramp could take place anywhere from 2018 to 2020. The predictions are all over the map. One way to predict the timing, progress and demand for 10nm is simple: Follow the fabs. In fact, Intel, Samsung, TSMC and GlobalFound... » read more

Applied-TEL Deal Faces Delays

By Mark LaPedus - 29 Oct, 2014 - Comments: 1

Applied Materials’ proposed move to acquire rival Tokyo Electron Ltd. (TEL) faces a possible delay. The blockbuster deal could get pushed out until next year amid a host of complicated regulatory issues. As reported in September of 2013, Applied Materials announced a definitive agreement to acquire TEL in a stock deal valued at around $9.3 billion. Under the terms, Applied Materials would ... » read more

Manufacturing Bits: July 22

By Mark LaPedus - 22 Jul, 2014 - Comments: 0

Skateboarding on 2D materials Two-dimensional materials are gaining steam in the R&D labs. The 2D materials include graphene, boron nitride (BN) and the transition-metal dichalcogenides (TMDs). These materials are attractive candidates for futuristic field-effect transistors (FETs). But researchers must gain more insight into these materials in order to understand their properties. For ... » read more

Executive Insight: CH Wu

By Ed Sperling - 21 Apr, 2014 - Comments: 0

Semiconductor Engineering sat down with CH Wu, president and CEO of Advantest Taiwan, to talk about business, politics, and his philosophy on what really motivates people. What follows are excerpts of that conversation. SE: Tell us a little about who you are and your background. Wu: I graduated from college with a degree in electrical engineering and started at Philips Electric, then moved ... » read more

Mixed Signals

By Mark LaPedus - 08 Jul, 2013 - Comments: 0

By Mark LaPedus Based on the various forecasts for semiconductor equipment, the mood is mixed at this week’s Semicon West trade show in San Francisco. In its mid-year forecast, for example, SEMI predicts that the semiconductor equipment market will reach $36.3 billion in 2013, down 1.7% over 2012. But the business is expected to rebound and reach $43.98 billion in 2014, a 21.2 percent inc... » read more

Taiwan: Aggressive Investments In Equipment For 2013-2014

By Christian Dieseldorff - 21 Feb, 2013 - Comments: 0

By Christian Gregor Dieseldorff Semiconductor equipment spending in 2012 declined significantly in the second half of the year as sluggish conditions in the global economy dampened some investments in the industry. Counter to this trend was spending in the Taiwan, which could come in at the $9.3 billion to $9.5 billion range. This represents $800 million more in equipment for Taiwan compared t... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.