Week In Review: Manufacturing, Test

By Mark LaPedus - 31 Dec, 2020 - Comments: 0

Chipmakers and OEMs Third Point, a hedge fund, released a letter, saying that Intel needs to explore its strategic alternatives. This includes the breakup of the chip giant. Obtained by Yahoo and others, the letter says Intel needs to decide “whether Intel should remain an integrated device manufacturer” and should divest certain failed acquisitions. Here’s another analysis of the sit... » read more

The Week In Review: Design

By Jesse Allen - 29 Sep, 2017 - Comments: 0

M&A Imagination will sell its MIPS business to Tallwood, a California-based venture capital firm, for $65m in cash. The sale is expected to close in October. The rest of Imagination is slated to be sold to Canyon Bridge for £550 million in cash (~$740 million), a deal dependent on the MIPS sale. The Chinese-backed investment firm has featured recently in the news for its attempted purchas... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 14 Nov, 2014 - Comments: 0

Intel’s McAfee unit announced its annual “12 Scams of the Holidays” list to educate the public on the most popular ways cybercriminals scam consumers during the holiday season. The German government has cleared Applied Materials’ proposed acquisition of Tokyo Electron Ltd. (TEL). The merger is still under examination by the competition authorities in the U.S., South Korea, Japan, Tai... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Tallwood

Week In Review: Manufacturing, Test

The Week In Review: Design

The Week In Review: Manufacturing