Re-Engineering Humanity

By Brian Bailey - 30 Apr, 2018 - Comments: 0

The technology industry is comfortable with trends that increase linearly for decades—and many that follow quadratic curves, also seemingly forever. Moore's Law and the rate of adoption of new technologies are two examples that come to mind. Those same trends can be used to scare or even create panic amongst a less informed general public. Such is the case with Artificial Intelligence (AI)... » read more

The Human Bottleneck

By Ed Sperling - 10 Dec, 2015 - Comments: 0

The history of semiconductor technology can be neatly summed up as a race to eliminate the next bottleneck. This is often done one process node at a time across an increasingly complex ecosystem. And it usually involves a high level of frustration, because the biggest problems stem from areas where engineering teams generally can't do anything about them. Concerns over the years have ranged ... » read more

The Next Big Things

By Ed Sperling - 30 Jul, 2015 - Comments: 0

Progress in electronics has always been about combining more functions into devices and making access to information more convenient. This is what drove the PC revolution in the 1980s, when centralized data was made available on desktops, and it's what drove the notebook PC revolution in the 1990s as computers became untethered from the desktop, as long as you could find an Ethernet connecti... » read more

Infrastructure, Then Integration

By Ed Sperling - 04 Aug, 2014 - Comments: 0

In any business and in any business segment, you have to start somewhere and then figure out what the likely end points will be and how to get there. It’s no different with the Internet of Things, except that the integration of different markets or applications is rather fuzzy at the moment. For example, it’s pretty easy to predict the possibilities for a car. It will likely move from co... » read more

President Obama Visits Applied Materials

By Applied Materials Writers - 16 May, 2013 - Comments: 0

By John Kania [caption id="attachment_8398" align="alignnone" width="518" caption="Applied Materials CEO Mike Splinter with President Barack Obama as they tour the Austin manufacturing clean room and hear from Applied employee Nilam D. Bhakta-Sahib about the complex chip making process. "][/caption] President Obama rode Air Force One into Austin, Texas, to shine a spotlight on the import... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.