tag: Teradyne

The Week In Review: Manufacturing
By Mark LaPedus - 03 Oct, 2014 - Comments: 0

Jimmy Kimmel, comedian and late night host of Jimmy Kimmel Live, replaces Lily Collins (Mirror, Mirror) as McAfee’s most dangerous celebrity to search for online. Cybercriminals are looking for ways to take advantage of consumer interest around popular cultural events. These criminals capitalize on the public’s fascination with celebrities to lure them to sites laden with malware, which ena... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 26 Sep, 2014 - Comments: 0

Is the sky falling on the ATE market? The ATE market is expected to hit $2.8 billion in 2014, up from $2.28 billion in 2013, according to Pacific Crest Securities. “Overall, we are now modeling overall semiconductor test demand to decline by 2% in 2015, a significant change from our previous estimate of up 10%,” said Weston Twigg, an analyst with Pacific Crest Securities, in a report. “Te... » read more

Has 3D NAND Fallen Flat?
By Mark LaPedus - 17 Jul, 2014 - Comments: 0

Today’s planar NAND technology will hit the wall at 10nm, prompting the need for the next big thing in flash memory—3D NAND. In fact, 3D NAND may extend NAND flash memory for the next several years and enable new applications. And it will also drive a new wave of fabs and tool orders. But the transition won’t be as smooth as previous rollouts. 3D NAND is harder to manufacture than pr... » read more

Five Disruptive Test Technologies
By Mark LaPedus - 19 Jun, 2014 - Comments: 0

For years, test has been a critical part of the IC manufacturing flow. Chipmakers, OSATs and the test houses buy the latest testers and design-for-test (DFT) software tools in the market and for good reason. A plethora of unwanted field returns is not acceptable in today’s market. The next wave of complex chips may require more test coverage and test times. That could translate into higher... » read more

SEMICON West Preview: Test
By Paula Doe - 19 Jun, 2014 - Comments: 0

Talking with the speakers scheduled to speak in the programs on IC testing at SEMICON West this year, I was struck by how much this equipment sector is changing as the value moves to software and the cloud. It has to be the first time I’ve ever mentioned PayPal in the same paragraph with semiconductor equipment, to say nothing of the business model of free hardware with software subscription.... » read more

How Much Testing Is Enough?
By Mark LaPedus - 15 May, 2014 - Comments: 1

As chipmakers move towards finer geometries, IC designs are obviously becoming more complex and expensive. Given the enormous risks involved, chipmakers must ensure the quality of the parts before they go out the door. And as part of quality assurance process, that requires a sound test strategy. But for years, IC makers have faced the same dilemma. On one hand, they want a stringent test me... » read more

Test Challenges Rising For Mobile Devices
By Mark LaPedus - 20 Mar, 2014 - Comments: 0

Smartphone and tablets continue to advance at a dizzying pace. On the component side alone, the latest mobile devices are moving towards 64-bit application processors, multi-mode RF front-ends, higher-end cameras and flashy LCD screens. Some systems even boast fingerprint scanners and heart rate sensors. But an obvious part of the system continues to lag behind the curve—battery life. In r... » read more

ATE Platform Strategy Gains Ground
By Kenji Tsuda - 10 Feb, 2014 - Comments: 0

More than a decade ago, at the urging of Intel, the ATE industry set out to reduce the cost of test in the digital chip market. Backed by companies such as Intel, Motorola, Renesas, Advantest and others, they formed an ATE consortium to make this all work. The aim of the consortium was to devise an "open architecture" for ATE. This would enable the development of third-party plug-and-play m... » read more

NAND ATE Market Gets Testy
By Mark LaPedus - 06 Feb, 2014 - Comments: 0

The NAND flash memory market is undergoing big changes. As planar NAND moves further down the 1xnm node regime, suppliers are ramping up devices with new cell structures, interfaces and other features. And on top of that, 3D NAND is beginning to appear in the market. The next-generation NAND devices will enable new applications in the mobile and enterprise markets, but the chips themselves p... » read more

Week In Review: Manufacturing, Design, Test
By Mark LaPedus - 17 Jan, 2014 - Comments: 0

A new study from Crucial.com reveals that on some days, 64% of U.S. parents spend more time with their computers than with family or close friends. TSMC posted mixed results in the fourth quarter of 2013. It also announced flat CapEx targets for 2014. TSMC also addressed Intel’s recent comments about TSMC’s finFET plans. Morris Chang, chairman of TSMC, said Intel’s comments are mislead... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy