Can Big Data Help Coverage Closure?

By Brian Bailey - 22 Mar, 2018 - Comments: 0

Semiconductor designs are a combination of very large numbers and very small numbers. There is a large numbers of transistors at very small sizes, and databases are often large. The chip industry has been looking at [getkc id="305" kc_name="machine learning"] to effectively manage some of this data, but so far datasets have not been properly tagged across the industry and there is a reluctan... » read more

Gaps In The Verification Flow

By Brian Bailey - 01 Nov, 2016 - Comments: 0

Semiconductor Engineering sat down to discuss the state of the functional verification flow with Stephen Bailey, director of emerging companies at [getentity id="22017" e_name="Mentor Graphics"]; [getperson id="11079" comment="Anupam Bakshi"], CEO of [getentity id="22168" e_name="Agnisys"]; [getperson id="11124" comment="Mike Bartley"], CEO of [getentity id="22868" e_name="Test and Verification... » read more

Gaps In The Verification Flow

By Brian Bailey - 25 Oct, 2016 - Comments: 0

Gaps In The Verification Flow

By Brian Bailey - 29 Sep, 2016 - Comments: 0

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Test and Verification solutions

Can Big Data Help Coverage Closure?

Gaps In The Verification Flow

Gaps In The Verification Flow

Gaps In The Verification Flow