Debug: Last Bastion Of Automation

By Brian Bailey - 27 Jan, 2016 - Comments: 0

There have been a number of times when anecdotal evidence became folk law and then over time, the effort was put in to find out whether there was any truth in it. Perhaps the most famous case is the statement that verification consumes 70% of development time and resources. For years this “fact” was used in almost every verification presentation and yet nobody knew where the number had come... » read more

Power Usage Shift Leads To Methodology Shift

By Mentor, a Siemens Business - 15 Jun, 2015 - Comments: 0

Veloce offers a unique and customized flow for SoC power exploration and analysis. Veloce Power Application is enabling a methodology shift in the way power measurements are done to address the new requirements due to usage shift. Chip designers do not need to rely on functional test benches and extrapolation techniques to come up with power number. The new flow enables booting OS, running live... » read more

Accellera Adds Portable Stimulus Group

By Brian Bailey - 11 Feb, 2015 - Comments: 0

[getentity id="22028" e_name="Accellera"] created a working group for the portable test and stimulus, which would allow engineering teams to create the test once and be able to run it throughout the flow. This is a big deal in verification because it allows horizontal reuse of a [getkc id="55" kc_name="testbench"]. Test patterns run on the processors in a design and that enables the test to ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: test benches

Debug: Last Bastion Of Automation

Power Usage Shift Leads To Methodology Shift

Accellera Adds Portable Stimulus Group