The New Road Warriors

By Jeff Dorsch - 27 Nov, 2017 - Comments: 0

Chip vendors and other companies that have little or no experience in automotive are flooding into this market as the race for assisted and autonomous driving begins to heat up. This market is expected to pay big dividends for companies that succeed in helping to build the vehicles of the future in this century. IC Insights earlier this year forecast the auto chip market would grow 22% this ... » read more

Here Comes High-Res Car Radar

By Mark LaPedus - 20 Nov, 2017 - Comments: 1

A dozen or so startups are developing high-resolution radar chips that use various modulation schemes and processes, such as CMOS, FD-SOI and even metamaterials. In theory, high-resolution radar could boost the capabilities of today’s radar for cars, as well as eliminate the need for a separate LiDAR system. But the technology is still in the research stage and has yet to be proven commerc... » read more

Radar Versus LiDAR

By Mark LaPedus - 23 Oct, 2017 - Comments: 6

Demand is picking up for vision, radar and LiDAR sensors that enable assisted and autonomous driving capabilities in cars, but carmakers are now pushing for some new and demanding requirements from suppliers. The automotive market always has been tough on suppliers. OEMs want smaller, faster and cheaper devices at the same or improved safety levels for both advanced driver-assistance systems... » read more

Why Fabs Worry About Tool Parts

By Mark LaPedus - 17 Aug, 2017 - Comments: 2

Achieving high yields with acceptable costs is becoming much more difficult as chipmakers migrate to next-generation 3D NAND and finFET devices—but not just because of rising complexity or lithography issues. To fabricate an advanced logic chip, for example, a wafer moves from one piece of equipment to another in what amounts to 1,000 process steps or more in a fab. Any glitch with the equ... » read more

IP Challenges Ahead

By Brian Bailey - 10 Aug, 2017 - Comments: 0

The revenue from semiconductor [getkc id="43" kc_name="IP"] has risen steadily to become the largest segment of the EDA industry. Industry forecasts expect it to keep growing at a CAGR of more than 10% for the next decade. Part one of this article examined the possibility those forecasts are wrong and that large semiconductor companies are likely to start bringing IP development back in hous... » read more

Foundries Accelerate Auto Efforts

By Mark LaPedus - 20 Jul, 2017 - Comments: 0

Foundries are ramping up their efforts in automotive chip production in preparation for a surge in semiconductors used in assisted and autonomous driving. All of the major foundry vendors are scrambling to assemble the pieces and expand their process portfolios for automotive customers. The foundries are seeing a growing demand from automotive IC customers amid the push toward advanced drive... » read more

IoT Myth Busting

By Brian Bailey - 13 Jul, 2017 - Comments: 0

The [getkc id="76" comment="Internet of Things"] (IoT) means many things to a large number of people, but one thing is clear—every discussion involving the IoT invariably includes some rather dramatic growth predictions for how many connected devices will be sold and who will be the primary beneficiaries. While that data helps spice up speeches, and typically gets people to read and quote ... » read more

Is The IP Industry Healthy?

By Brian Bailey - 13 Jul, 2017 - Comments: 0

The semiconductor industry has been through many changes, each designed to reduce the total cost associated with the design and manufacture of chips. Twenty years ago, most companies had their own fabs and designed all of the circuitry on each chip. Today, only a handful of companies still own a fab and outsourcing design, in the form of intellectual property ([getkc id="43" kc_name="IP"]), has... » read more

Wirebond Technology Rolls On

By Mark LaPedus - 08 May, 2017 - Comments: 2

Several years ago, many predicted the demise of an older interconnect packaging technology called wire bonding, prompting the need for more advanced packaging types. Those predictions were wrong. The semiconductor industry today uses several advanced packaging types, but wire bonding has been reinvented over the years and remains the workhorse in packaging. For example, Advanced Semiconducto... » read more

The Week In Review: IoT

By Jeff Dorsch - 17 Mar, 2017 - Comments: 0

Government Maureen Ohlhausen, the acting head of the Federal Trade Commission, said in an interview that she looks to manufacturers of Internet-connected devices to decide on best practices for the Internet of Things. Although the FTC has the legal authority to set regulations for a variety of industries, Ohlhausen said the commission is “not primarily a regulator,” in line with the new ad... » read more

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Knowledge Centers
Entities, people and technologies explored

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