Week in Review – IoT, Security, Autos


Products/Services Rambus entered an exclusive agreement to acquire the Silicon IP, Secure Protocols, and Provisioning business from Verimatrix, formerly known as Inside Secure. Financial terms were not revealed. The transaction is expected to close this year. Rambus will use the Verimatrix offerings in such demanding applications as artificial intelligence, automotive, the Internet of Things, ... » read more

Week in Review: IoT, Security, Autos


Products/Services Huawei Technologies is again delaying the public introduction of its Mate X foldable smartphone. It is unlikely the product will be marketed in the U.S., given the ongoing trade war. The official rollout now seems likely to come in November, in time for the holiday shopping season. Samsung Electronics has had its problems with foldable phones, yet those were due to manufactur... » read more

Week in Review: IoT, Security, Autos


Products/Services Arm released a survey of 650 industry representatives about eSIM and iSIM technology. Ninety percent of the respondents were aware of eSIM, while 43% were unaware of iSIM. Vincent Korstanje, vice president and general manager, Emerging Businesses at Arm, cites the leading three obstacles to large commercial deployments: Resistance from traditional stakeholders (69% of respond... » read more

Week in Review: IoT, Security, Auto


Internet of Things AT&T reports the activation of its narrowband Internet of Things network in the U.S. The carrier upgraded its 4G LTE cell sites across the country. It now offers two low-power wide-area networks to business customers, including its LTE-M network in Mexico and the U.S. “Both networks are designed for the IoT within licensed spectrum and provide carrier-grade security,... » read more

The Week In Review: Manufacturing


Chipmakers At this week’s International Wafer-Level Packaging Conference (IWLPC), Samsung disclosed details about its efforts in the panel-level fan-out market. Samsung as well as ASE, Nepes and others are developing a next-generation fan-out technology using a panel-level format. In panel-level fan-out packaging, you can put more die on a panel as compared to a traditional round wafer, w... » read more