tag: thermal dissipation

Cooling Chips Still A Top Challenge
By Bryon Moyer - 22 May, 2025 - Comments: 0

Increasing levels of semiconductor integration means more work needs to be done in smaller spaces, which in turn generates more heat that needs to be dissipated. Managing heat dissipation in advanced node dies and in multi-die assemblies is critical to their functionality and their longevity. And while much of the focus has been on improving power efficiency, which reduces the rate of power ... » read more

Three-Way Race To 3D-ICs
By Ed Sperling - 05 May, 2025 - Comments: 1

Intel Foundry, TSMC, and Samsung Foundry are scrambling to deliver all the foundational components of full 3D-ICs, which collectively will deliver orders of magnitude improvements in performance with minimal power sometime within the next few years. Much attention has been focused on process node advances, but a successful 3D-IC implementation is much more complex and comprehensive than just... » read more

Advanced Packaging Moving At Breakneck Pace
By Ed Sperling And Laura Peters - 29 Jan, 2025 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss advances in packaging with Michael Kelly, vice president of Chiplets and FCBGA Integration at Amkor; William Chen, fellow at ASE; Dick Otte, CEO of Promex Industries; and Sander Roosendaal, R&D director at Synopsys Photonics Solutions. What follows are excerpts of that discussion. [Part 2 of the discussion is here.] ... » read more

Testing For Thermal Issues Becomes More Difficult
By Gregory Haley - 10 Dec, 2024 - Comments: 0

Increasingly complex and heterogeneous architectures, coupled with the adoption of high-performance materials, are making it much more difficult to identify and test for thermal issues in advanced packages. For a single SoC, compressing higher functionality into a smaller area concentrates the processing and makes thermal effects more predictable. But that processing can happen anywhere in a... » read more

AI Drives IC Design Shifts At The Edge
By Adam Kovac and Ed Sperling - 07 Nov, 2024 - Comments: 0

The increasing adoption of AI in edge devices, coupled with a growing demand for new features, is forcing chipmakers to rethink when and where data gets processed, what kind of processors to use, and how to build enough flexibility into systems to span multiple markets. Unlike in the cloud, where the solution generally involves nearly unlimited resources, computing at the edge has sharp cons... » read more

Intel Vs. Samsung Vs. TSMC
By Ed Sperling - 15 Jul, 2024 - Comments: 3

The three leading-edge foundries — Intel, Samsung, and TSMC — have started filling in some key pieces in their roadmaps, adding aggressive delivery dates for future generations of chip technology and setting the stage for significant improvements in performance with faster delivery time for custom designs. Unlike in the past, when a single industry roadmap dictated how to get to the next... » read more

Why There Are Still No Commercial 3D-ICs
By Brian Bailey - 29 Jan, 2024 - Comments: 0

Building chips in three dimensions is drawing increased attention and investment, but so far there have been no announcements about commercial 3D-IC chips. There are some fundamental problems that must be overcome and new tools that need to be developed. In contrast, the semiconductor industry is becoming fairly comfortable with 2.5D integration, where individual dies are assembled on some k... » read more

What’s Changing In DRAM
By Ed Sperling - 22 Jan, 2024 - Comments: 0

More data requires more processing and more storage, because that data needs to be stored somewhere. What’s changing is that it’s no longer just about SRAM and DRAM. Today, multiple types of DRAM are used in the same devices, each with its own set of tradeoffs. C.S. Lin, marketing executive at Winbond, talks about the potential problems that causes, including mismatches in latency, and high... » read more

Getting Rid Of Heat In Chips
By Brian Bailey - 20 Jul, 2023 - Comments: 1

Power consumed by semiconductors creates heat, which must be removed from the device, but how to do this efficiently is a growing challenge. Heat is the waste product of semiconductors. It is produced when power is dissipated in devices and along wires. Power is consumed when devices switch, meaning that it is dependent upon activity, and that power is constantly being wasted by imperfect de... » read more

True 3D-IC Problems
By Brian Bailey - 27 Apr, 2023 - Comments: 0

Placing logic on logic may sound like a small step, but several problems must be overcome to make it a reality. True 3D involves wafers stacked on top of each other in a highly integrated manner. This is very different from 2.5D integration, where logic is placed side-by-side, connected by an interposer. And there are some intermediate solutions today where significant memory is stacked on l... » read more

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