Dealing With Noise In Image Sensors

By Karen Heyman - 01 Feb, 2024 - Comments: 0

The expanding use and importance of image sensors in safety-critical applications such as automotive and medical devices has transformed noise from an annoyance into a life-threatening problem that requires a real-time solution. In consumer cameras, noise typically results in grainy images, often associated with poor lighting, the speed at which an image is captured, or a faulty sensor. Typi... » read more

Ins And Outs Of In-Circuit Monitoring

By Ed Sperling - 21 Jul, 2020 - Comments: 2

At 7nm and 5nm, in-circuit monitoring is becoming essential. Steve Crosher, CEO of Moortec, talks about the impact of rising complexity, how different use cases and implementations can affect reliability and uptime, and why measuring electrical, voltage and thermal stress can be used to statistically predict failures and improve reliability throughout a chip’s lifetime. » read more

New Memory Approaches And Issues

By Ed Sperling - 14 Mar, 2016 - Comments: 1

New memory types and approaches are being developed and tested as DRAM and Moore's Law both run out of steam, adding greatly to the confusion of what comes next and how that will affect chip designs. What fits where in the memory hierarchy is becoming less clear as the semiconductor industry grapples with these changes. New architectures, such as [getkc id="202" kc_name="fan-outs"] and [getk... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: thermal gradient

Dealing With Noise In Image Sensors

Ins And Outs Of In-Circuit Monitoring

New Memory Approaches And Issues