A new technical paper titled "DeepOHeat: Operator Learning-based Ultra-fast Thermal Simulation in 3D-IC Design" was published (preprint) by researchers at UCSB and Cadence.
Abstract
"Thermal issue is a major concern in 3D integrated circuit (IC) design. Thermal optimization of 3D IC often requires massive expensive PDE simulations. Neural network-based thermal prediction models can perform ...
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