Where Are The IoT Industry Standards?

By Jeff Dorsch - 10 Oct, 2016 - Comments: 0

Are you ready for some Internet of Things standards? Good, because you can help make them. The IoT is proceeding apace as a business, eagerly embraced by such corporate behemoths as Cisco Systems, General Electric, IBM, and Verizon Communications. What’s lacking is the codification of industry standards for the IoT, as many companies have aligned with groups that have competing agendas and... » read more

The Week in Review: IoT

By Jeff Dorsch - 29 Jul, 2016 - Comments: 0

Deals Analog Devices this week agreed to purchase Linear Technology for $60 a share in cash and stock, a proposed purchase worth about $14.8 billion. The transaction will wrap up next year, if antitrust regulators and Linear Tech’s shareholders give it the green light. Both chip companies are very active in Internet of Things technologies, with ADI acquiring Switzerland-based SNAP Sensor ear... » read more

The Week In Review: Design

By Ed Sperling - 17 Jul, 2014 - Comments: 0

Tools Cadence unveiled two new tools. The first is a rapid prototyping platform that the company claims will shorten bring-up time by 70%, with 4X improvements in capacity, with IEEE 1801 support for low-power verification through its emulation platform. The second is a single and multi-corner custom/analog extraction tool, which it claims will improve performance by 5X. The tool has been cert... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

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AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

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Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

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Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

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The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

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Megafabs churning out the most advanced processors are not the only game in town.

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Where Are The IoT Industry Standards?

The Week in Review: IoT

The Week In Review: Design