Automotive Functional Safety Compliance In EDA Tools And IP

By Swami Venkat - 01 Feb, 2021 - Comments: 1

By Swami Venkat and Meirav Nitzan A modern vehicle can boast as many as 100 million lines of code—that’s more than the Large Hadron Collider (50 million lines) and Facebook (62 million lines). On the hardware side, many of today’s cars have upwards of 100 electronic control units (ECUs) to run various functions. As automotive engineering ingenuity continues to drive further innovation ... » read more

Shifting the Burden of Tool Safety Compliance from Users to Vendor

By OneSpin Solutions - 30 Jan, 2019 - Comments: 0

The security, safety and performances of autonomous vehicles, railways, aerospace, nuclear power plants and medical devices rely on electronic systems and their hardware components. Engineers use advanced software tools to develop complex hardware. Tools may malfunction, generate erroneous output and ultimately introduce or fail to detect systematic hardware faults that could cause hazardous ev... » read more

Demystifying EDA Support For ISO 26262 Tool Qualification

By Sergio Marchese - 23 Aug, 2018 - Comments: 0

My new, mid-size car is equipped with many advanced driver-assistance systems. To be honest, it’s taking me time to get used to some of them, as, for example, lane-centering assist that seamlessly takes control of my steering wheel. However, I cannot wait to get my hands off a fully autonomous vehicle and be able to take a nap while 7nm chips run machine learning and other artificial intellig... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: tool confidence level

Automotive Functional Safety Compliance In EDA Tools And IP

Shifting the Burden of Tool Safety Compliance from Users to Vendor

Demystifying EDA Support For ISO 26262 Tool Qualification