5th Generation CAPSENSE Technology

By Infineon - 05 Jul, 2023 - Comments: 0

Capacitive touch sensing is a familiar and popular way to implement sleek, attractive and intuitive human-machine interfaces (HMIs) in devices such as smartphones, tablets and automotive displays. Now many manufacturers operating elsewhere, including in the industrial automation and home appliance markets, are exploring ways to increase the appeal, usability and value of their products by re... » read more

Research Bits: March 28

By Susan Rambo - 28 Mar, 2023 - Comments: 0

Modeling how the nose smells The first 3D molecular-level picture of how an odor molecule binds to and activates an odorant receptor (OR) on olfactory cells in the nose may help us understanding and eventually be used to build a map of all the receptors. Scientists at UC San Francisco (UCSF) used cryo-electron microscopy (cryo-EM), which UCSF developed, to take a moving picture of the wiggly r... » read more

2022 Is the International Year of Glass

By Paul McLellan - 06 Jan, 2022 - Comments: 0

Happy New Year! It's 2022, and I like to ease into the year gently and see what this year is the "year of." The United Nations always selects a couple of areas, and there are events all over the world during the year. International Year of Glass First, it is the International Year of Glass, or IYoG2022. Our vision of a United Nations International Year of Glass (IYoG2022) is to cel... » read more

Power/Performance Bits: Feb. 25

By Jesse Allen - 25 Feb, 2020 - Comments: 0

Thinner, flexible touchscreens Researchers from RMIT University, University of New South Wales, and Monash University developed a thin, flexible electronic material for touchscreens. The material is 100 times thinner than current touchscreen materials. The new screens are still based on indium-tin oxide (ITO), a common touchscreen material. However, a liquid metal printing approach was used... » read more

Power/Performance Bits: Nov. 5

By Jesse Allen - 05 Nov, 2019 - Comments: 0

Conductive yarn Researchers at Drexel University created an electrically conductive coating for yarn that withstands wearing, washing, and industrial textile manufacturing. Rather than using metallic fibers, the coating is made up of different sized flakes of the two-dimensional material MXene, which was applied to standard cellulose-based yarns. Titanium carbide MXene can be produced in f... » read more

Power/Performance Bits: May 31

By Jesse Allen - 31 May, 2016 - Comments: 0

Solar thermophotovoltaics A team of MIT researchers demonstrated a device based on a method that enables solar cells to break through a theoretically predicted ceiling on how much sunlight they can convert into electricity. Since 1961 it has been known that there is an absolute theoretical limit, called the Shockley-Queisser Limit, to how efficient traditional solar cells can be in their ... » read more

Interacting With Printed Sensors

By Michael Watts - 02 Aug, 2013 - Comments: 0

By Michael P.C. Watts If there is one feature that distinguishes all our modern portable devices from the traditional PC (a wonderful concept—the “traditional PC”), it’s the way we interact. Separate keyboards are done. It's all touchscreens on pretty much everything, along with other sensor opportunities. There are many uses for the built-in cameras in cell phones from videoconfere... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer