SEMI Calls For U.S.-China Tariff Removals

By Jay Chittooran - 20 Jun, 2019 - Comments: 0

In testimony today before a U.S. government interagency panel considering tariffs on $300 billion worth of Chinese goods, SEMI called for the removal of about 30 tariff lines, which cover items central to the semiconductor manufacturing process. Mike Russo, vice president of global industry advocacy at SEMI, explained in his testimony that while SEMI strongly supports efforts to better... » read more

Blog Review: June 5

By Jesse Allen - 05 Jun, 2019 - Comments: 0

Mentor's Neil Johnson argues that coverage closure shouldn't have to be mad scramble in the home stretch of development if designers change their early development mindset. In a video, Cadence's Amol Borkar explains Simultaneous Localization and Mapping, or SLAM, from the creation of a map of an unknown environment and understanding the orientation of a camera in this space. Synopsys' Tay... » read more

SEMI Members Mobilize For 2017 SEMI Washington Forum

By Jamie Girard - 20 Apr, 2017 - Comments: 0

SEMI hosted 24 industry executives in Washington, DC on March 28 & 29 to take part in the annual SEMI Washington Forum. The Washington Forum, which is supported by SEMI’s North American Advisory Board (NAAB), gives SEMI member company executives a chance to come to the Nation’s capital for a firsthand experience in engaging policymakers on the issues that are pertinent to the industry. ... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: trade

SEMI Calls For U.S.-China Tariff Removals

Blog Review: June 5

SEMI Members Mobilize For 2017 SEMI Washington Forum

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