Blog Review: June 5

Coverage mindset; SLAM explained; code reuse attacks.


Mentor’s Neil Johnson argues that coverage closure shouldn’t have to be mad scramble in the home stretch of development if designers change their early development mindset.

In a video, Cadence’s Amol Borkar explains Simultaneous Localization and Mapping, or SLAM, from the creation of a map of an unknown environment and understanding the orientation of a camera in this space.

Synopsys’ Taylor Armerding looks at what’s in the executive order intended to boost the number of cybersecurity professionals and whether it does enough to address the skills shortage.

Arm’s Luke Cheeseman digs into code reuse attacks, how they work, and how modern compilers can help prevent them.

SEMI’s Mike Russo explains the impact of the trade tensions between the U.S. and China, what it will cost the semiconductor industry, and the organization’s efforts to influence trade policy.

A Rambus writer checks out efforts at MIT to determine the robustness levels of machine learning models by testing them against adversarial examples.

ANSYS’ Shawn Wasserman takes a look at how startup Nanusens is trying to shrink MEMS to even smaller ‘NEMS’ that are based on standard CMOS process.

And don’t miss the blogs featured in last week’s System Level Design newsletter:

Editor in Chief Ed Sperling contends that current implementations of AI have just scratched the surface of what this technology can do, which creates its own set of issues.

Technology Editor Brian Bailey observes that the slowdown in Moore’s Law is opening the door to more open-source IP and EDA.

Mentor’s Chris Giles points out that digital systems need clocks, but today’s designs require more from clocking schemes than ever before.

Synopsys’ Shreedhar Ramachandra and Himanshu Bhatt explain how to use UPF information model APIs to write reusable low-power testbenches that can monitor and control UPF objects.

OneSpin’s John Hallman warns that as the supply chain of components and IP expands, so do the opportunities for adversarial tampering.

eSilicon’s Mike Gianfagna reveals a collaboration that overcomes tough signal and power integrity challenges.

UltraSoC’s Aileen Ryan contends that the market should be more concerned about automotive security and safety.

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