Week in Review: IoT, Security, Auto


Internet of Things Release 3 is published by oneM2M, the worldwide Internet of Things interoperability standards initiative. The third set of specifications deals with 3GPP interworking, especially as it relates to cellular IoT connectivity, among other features. The release is said to enable seamless interworking with narrowband IoT and LTE-M connectivity through the 3GPP Service Capability E... » read more

China’s Electric Car Ambitions


China, the world’s largest car market, is also leading the charge in the electric vehicle business. But with little or no fanfare, China also wants to dominate the critical ecosystem for battery-electric vehicles and hybrids. In fact, the nation is already the world’s largest producer of batteries for electric vehicles. And it also controls a sizable part of the supply chain, such as the... » read more

AI’s Long-Term Impact


Artificial intelligence technology will have a significant impact on the world’s economy in the months and years ahead, the McKinsey Global Institute forecasts in a new report. Certain companies and some countries will greatly benefit in the new era of AI, leaving others behind, the business and economics research arm of McKinsey & Co. predicts. The key takeaway points of the report: ... » read more

Cobalt Shortages Ahead


Rapid growth of electric vehicles is creating an enormous demand for cobalt, causing tight supply, high prices and supply chain issues for this critical material. Cobalt is a ferromagnetic metal and one of the key materials used in lithium-ion batteries for cell phones, notebook PCs, battery-electric cars and hybrids. It also is used in alloys and semiconductors. And while the IC industry co... » read more

Week In Review: Manufacturing, Test


Packaging Brewer Science has introduced the latest additions to its family of temporary bonding materials. The company also rolled out its new line of thin spin-on packaging materials. The company’s temporary bonding materials are called BrewerBOND. The new products, called the BrewerBOND T1100 and BrewerBOND C1300 series, are combine to create a dual-layer system for temporary bonding a... » read more

3D NAND Flash Wars Begin


3D NAND suppliers are gearing up for a new battle amid a period of price and competitive pressures, racing each other to the next technology generations. Competition is intensifying as a new player enters the 3D NAND market—China’s Yangtze Memory Technologies Co. (YMTC). Backed by billions of dollars in funding from the Chinese government, YMTC recently introduced its first 3D NAND techn... » read more

Week in Review: IoT, Security, Auto


Cybersecurity Check Point Software Technologies reports that facsimile machines (yes, people still use them!) can be subject to hacking through vulnerabilities in their communication protocols. The HP Officejet Pro All-in-One fax printers and other fax machines can be compromised with a hacker only knowing a fax number, according to the company. Check Point Research says a design flaw in Andro... » read more

The Hidden Cost Of Tariffs


The impact of tariffs on the semiconductor industry is just now being assessed, but there's a lot more to this picture than import and export duties. In fact, the biggest and longest-lasting effects may have less to do with taxing imports than what happens across the global supply chain that includes everything from manufacturing equipment to materials to investment capital. Import duti... » read more

Big Shifts In Tech Conferences


By Ed Sperling and Katherine Derbyshire Identifying central themes in technology conferences, or finding enough latitude where the theme is extremely well defined, is becoming challenging throughout the tech industry. Throughout the semiconductor industry, in particular, many are asking how various organizations will differentiate conferences in the future and who will be the target audience... » read more

Blog Review: Aug. 15


Cadence's Paul McLellan checks out what's driving the growth of China's semiconductor industry plus the state of fab construction, from a CAPSA presentation by SEMI's Lung Chu. Mentor's Joe Hupcey III has some tips for how to handle inconclusive results in formal verification, starting with how to identify where the analysis got stuck. Synopsys' Taylor Armerding listens in on a presentati... » read more

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