Securing Advanced Packaging Supply Chain With Inherent HW Identifiers Using Imaging Techniques


A new technical paper titled "Fault-marking: defect-pattern leveraged inherent fingerprinting of advanced IC package with thermoreflectance imaging" was published by researchers at University of Florida and University of Cincinnati. "This work visits the existing challenges and limitations of traditional embedded fingerprinting and watermarking approaches, and proposes the notion of inherent... » read more

Manufacturing Bits: Jan. 10


Finding new materials with inverse design The Singapore-MIT Alliance for Research and Technology (SMART) has found a new way to perform general inverse design, a technique that can accelerate the discovery of new materials. The concept of inverse design is simple. Let’s say you want to develop products with select materials. In a computer, you input the desired materials and the propertie... » read more