Blog Review: April 2

By Ed Sperling - 02 Apr, 2014 - Comments: 0

Mentor’s Nazita Saye compares roadway roundabouts to networked systems. One roundabout works fine, but add in a bunch of them and you have a massive traffic jam. How many roundabouts are in your design? Cadence’s Richard Goering interviews Stan Kroliskoski, chair of the IEEE Design Automation Standards Committee, about four working groups on EDA standards and what’s ahead. Speaking ... » read more

The Case For Extensible Processors

By Neil Hand - 22 Aug, 2013 - Comments: 0

By Neil Hand In a previous post I talked about how intelligent subsystems are going to impact overall system design. Because many more design teams are going to be required to implement complex processing power into there subsystems, I thought it time to expand on that topic and talk a little about options available to add that intelligence. One size does not fit all The traditional approa... » read more

The (R)evolution Of Intelligent IP Subsystems

By Neil Hand - 30 May, 2013 - Comments: 0

IP subsystems have gone from talking point to reality in a very short period of time, but most coverage focuses on a hardware integrators view. The system integrator’s view is very different because the task of software integration is now vastly more complex dealing with software from multiple providers, using different assumptions and with different requirements. This effort, already larger ... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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Blog Review: April 2

The Case For Extensible Processors

The (R)evolution Of Intelligent IP Subsystems

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Knowledge Centers
Entities, people and technologies explored