The New Face of Formal

By Brian Bailey - 04 Nov, 2015 - Comments: 0

Semiconductor engineering sat down to discuss the recent growth in adoption of formal technologies and tools with Lawrence Loh, product engineering group director at [getentity id="22032" e_name="Cadence"], Praveen Tiwari, senior manager R&D, verification group at [getentity id="22035" e_name="Synopsys"], Harry Foster, chief scientist at [getentity id="22017" e_name="Mentor Graphics"], Normando... » read more

What’s Really Inside?

By Ed Sperling - 04 Jun, 2015 - Comments: 2

Is it just paranoia, or do devices ranging from industrial controls to military hardware really contain malicious code, Trojan Horses, and remotely triggered back doors? The answer is "maybe not" if you're an optimist, and "maybe" if you're a pessimist, but no one really knows for sure. And that's what really worries security experts, particularly as more devices are connected to other devices.... » read more

Securing The IoT

By Ed Sperling - 20 Oct, 2014 - Comments: 1

Semiconductor Engineering sat down to discuss whether the [getkc id="76" comment="Internet of Things"] will be secure enough, or whether it will create new security issues, with Sami Nassar, general manager of [getentity id="22499" comment="NXP Semiconductor"]; Oleg Logvinov, director for special assignments at [getentity id="22331" comment="STMicroelectronics"]; and Lawrence Loh, application e... » read more

Knowledge Centers
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Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

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AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

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Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

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eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

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by Brian Bailey

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Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Trojan horses

The New Face of Formal

What’s Really Inside?

Securing The IoT

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