Startup Funding: February 2023

By Jesse Allen - 08 Mar, 2023 - Comments: 0

The cost of borrowing is going up, but investors continued to pour money into the chip industry in February. Collectively, 132 companies raised more than $4.5 billion last month. One of the big beneficiaries was quantum computing, with nine companies drawing a total of more than $500 million. The bulk of that went to a quantum software and services company spun out of Alphabet, but plenty wa... » read more

Startup Funding: Aug. 2022

By Jesse Allen - 11 Sep, 2022 - Comments: 0

Investors funneled $1.9 billion into startups last month. The total was down from the previous few months for companies tracked by Semiconductor Engineering, but still a strong showing for the chip industry and related technologies. By market segment, power devices were a bright spot in August's funding, with 12 companies receiving new financing rounds. A manufacturer of multilayer ceramic c... » read more

Startup Funding: August 2022 Sortable Funding Chart

By Jesse Allen - 08 Sep, 2022 - Comments: 0

Below is a sortable chart that accompanies your e-book purchase of Semiconductor Engineering's August 2022. Startup Funding report. Simply click on the top headers to determine your primary sort. [table id=52 /] The complete ebook (over 40 pages) can be found here. » read more

Startup Funding: August 2022

By Jesse Allen - 07 Sep, 2022 - Comments: 0

Startup Funding: March 2022

By Jesse Allen - 04 Apr, 2022 - Comments: 0

Semiconductor manufacturing, test, and inspection equipment startups did well in March. Investors funded a wide variety of equipment companies, including test equipment, materials handling, and those that make parts and components. In the manufacturing space, several companies developing manufacturing execution systems received funding, as well as a startup trying to prevent counterfeit parts f... » read more

Startup Funding: August 2021

By Jesse Allen - 01 Sep, 2021 - Comments: 0

More than $3.5 billion in funding was funneled into 35 startups last month, much of that scattered across the globe. Several Chinese companies received significant funding as the country bulks up domestic production of wafers and GPUs. In addition, with attention increasing on the need for electric vehicles and renewable energy, big investments went into battery manufacturing startups. One comp... » read more

June’19 Startup Funding

By Jeff Dorsch - 11 Jul, 2019 - Comments: 0

During the month of June, there were 15 startups that brought in funding rounds of $100 million or more, as investors continued to chase deals in cybersecurity, automotive technology, semiconductors, and a variety of services. There were no billion-dollar deals as spring slid into summer; yet, those 15 companies together raised a total of about $3.13 billion. Aurora Innovation, the developer... » read more

LiDAR Market Continues To Percolate

By Jeff Dorsch - 13 Sep, 2017 - Comments: 0

Light imaging, detection, and ranging (LiDAR) sensors are still dazzling investors and technologists. They are chasing after the technology for automotive applications, while also keeping an eye on LiDAR for drones, industrial automation, mapping, and robotics, among other uses. It’s too early to tell how market share for automotive LiDAR is shaping up, as the bigger vendors are still work... » read more

The LiDAR Gold Rush

By Jeff Dorsch - 12 Jun, 2017 - Comments: 0

Big money is pouring into the LiDAR market, as carmakers gear up for autonomous and assisted driving. LiDAR, along with advanced computer vision and radar sensors, is an essential component for vehicles to maneuver without hitting obstacles or other cars. LiDAR is an acronym for light imaging, detection, and ranging, and until now it has been almost synonymous with next-generation automotive... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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