Week In Review: Auto, Security, Pervasive Computing

By Ed Sperling - 22 Oct, 2021 - Comments: 0

An investigation by the Automobile Association of America found that lane-keeping assist and automatic emergency braking, both high-profile ADAS features, are prone to failure in rain. According to the report, 69% of tests conducted with simulated rainfall resulted in test vehicles crossing lane markers, and 33% of simulations resulted in collisions at 35 mph. Surprisingly, risk of accidents di... » read more

Electronics Supply-Chain Trust Standards Emerge

By Bryon Moyer - 07 Jan, 2021 - Comments: 0

Creative new ideas for electronics supply-chain trust are in rich supply, whether securing identity, protecting logistics, or establishing provenance. But underlying these efforts are wide-ranging standards in development from a broad set of organizations. Today, no one-stop-shop for supply-chain standards exists. Instead, there is huge fragmentation. It can be difficult to identify all of t... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 29 Mar, 2019 - Comments: 0

Internet of Things Organizers for the Internet of Things World 2019 conference, coming up on May 13-16 in Santa Clara, Calif., surveyed more than 100 IoT leaders in various industries. Implementation (34%) and security (25%) were the highest concerns for the respondents. Those were followed by initial purchase (17%), scalability (10%), business buy-in (8%), and upkeep costs (3%). Two-thirds of... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Trusted Computing Group

Week In Review: Auto, Security, Pervasive Computing

Electronics Supply-Chain Trust Standards Emerge

Week in Review: IoT, Security, Auto