Chip Industry Week In Review

By The SE Staff - 13 Sep, 2024 - Comments: 0

Infineon rolled out the world's first 300mm gallium nitride (GaN) wafer, opening the door for high-volume manufacturing of GaN-based power semiconductors. A 300mm wafer contains 2.3 times as many chips per wafer as a 200mm wafer. Fig.1: Infineon's 300mm GaN wafer. Source: Infineon The Semiconductor Industry Association released its 2024 State of the U.S. Semiconductor Industry report th... » read more

Chip Industry Week In Review

By The SE Staff - 06 Sep, 2024 - Comments: 0

Concerns mount on the use of American-manufactured semiconductors in Russian weapons, with Analog Devices, AMD, Intel and TI set to testify next week before the U.S. Senate Permanent Subcommittee on Investigations. Also, U.S. and other government agencies issued a joint advisory and more details about ongoing Russian military cyberattacks, espionage, and sabotage. The U.S. Commerce Departmen... » read more

ECTC 2024 Session Readout: Advancement of Metrology

By Technical Paper Link - 04 Sep, 2024 - Comments: 0

A Electronic Components and Technology Conference (ECTC) session report titled "2024 ECTC Special Session Report: Advancing Metrology for Next-Generation Microelectronics" was published by NIST, Binghamton University, and TechSearch International. Abstract: "Metrology plays a pivotal role in semiconductor research, manufacturing, packaging and assembly. It is critical to the success of this... » read more

Chip Industry Week In Review

By The SE Staff - 23 Aug, 2024 - Comments: 0

Chinese firms imported almost $26 billion worth of chipmaking machinery, according to fresh trade data released by China’s General Administration of Customs this week, Bloomberg reports. Meanwhile, the global semiconductor manufacturing industry continued to show signs of improvement in Q2 2024 with significant growth of IC sales, stabilizing capital expenditure, and an increase in install... » read more

Why Small Fab And Assembly Houses Are Thriving

By Bryon Moyer - 15 Aug, 2024 - Comments: 0

High-volume products get more than their fair share of attention in the semiconductor world, but most chips don't fit into that category. While a few huge fabs and offshore assembly and test (OSAT) houses process enormous volumes of chips, small fabs and packaging lines serve for lower volumes, specialized technology, and prototyping. “There are companies that run literally one lot of 25 w... » read more

Chip Industry Week in Review

By The SE Staff - 02 Aug, 2024 - Comments: 0

Okinawa Institute of Science and Technology proposed a new EUV litho technology using only four reflective mirrors and a new method of illumination optics that it claims will use 1/10 the power and cost half as much as existing EUV technology from ASML. Applied Materials may not receive expected U.S. funding to build a $4 billion research facility in Sunnyvale, CA, due to internal government... » read more

Key Technologies To Extend EUV To 14 Angstroms

By Laura Peters - 29 Jul, 2024 - Comments: 3

The top three foundries plan to implement high-NA EUV lithography as early as 2025 for the 18 angstrom generation, but the replacement of single exposure high-NA (0.55) over double patterning with standard EUV (NA = 0.33) depends on whether it provides better results at a reasonable cost per wafer. So far, 2024 has been a banner year for high-numerical aperture EUV lithography. Intel Foundry... » read more

New Interconnect Metals Need New Dielectrics

By Katherine Derbyshire - 23 Jul, 2024 - Comments: 0

Just as circuit metallization must evolve to manage resistance as features shrink, so must the dielectric half of the interconnect stack. For quite some time, manufacturers have needed a dielectric constant (k) less than 4, which is the value for SiO2, but they have struggled to find materials that combine a low dielectric constant with mechanical and chemical stability. In work presented at... » read more

Chip Industry Week In Review

By The SE Staff - 19 Jul, 2024 - Comments: 0

The University of Texas at Austin’s Texas Institute for Electronics (TIE) was awarded $840 million to establish a Department of Defense microelectronics manufacturing center. This center will focus on developing advanced semiconductor microsystems to enhance U.S. defense systems. The project is part of DARPA's NGMM Program. The U.S. Dept. of Commerce announced preliminary terms with Global... » read more

Intel Vs. Samsung Vs. TSMC

By Ed Sperling - 15 Jul, 2024 - Comments: 3

The three leading-edge foundries — Intel, Samsung, and TSMC — have started filling in some key pieces in their roadmaps, adding aggressive delivery dates for future generations of chip technology and setting the stage for significant improvements in performance with faster delivery time for custom designs. Unlike in the past, when a single industry roadmap dictated how to get to the next... » read more

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tag: TSMC

Chip Industry Week In Review

Chip Industry Week In Review

ECTC 2024 Session Readout: Advancement of Metrology

Chip Industry Week In Review

Why Small Fab And Assembly Houses Are Thriving

Chip Industry Week in Review

Key Technologies To Extend EUV To 14 Angstroms

New Interconnect Metals Need New Dielectrics

Chip Industry Week In Review

Intel Vs. Samsung Vs. TSMC

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