Money Pours Into New Fabs And Facilities

By Liz Allan - 03 Jan, 2024 - Comments: 0

Fabs, packaging, test and assembly, and R&D all drew major funding in 2023. Companies poured money into offshore locations, such as India and Malaysia, to access a larger workforce and lower costs, while also partnering with governments to secure domestic supply chains amid ongoing geopolitical turmoil. Looking ahead, artificial intelligence (AI), quantum computing, and data applications... » read more

Data, System Reliability, and Privacy

By Anne Meixner - 04 Oct, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss changes in test that address tracing device quality throughout a product’s lifetime, and over-arching concerns about data ownership and privacy, with Tom Katsioulas, CEO at Archon Design Solutions and U.S. Department of Commerce IoT advisory board member; Ming Zhang, vice president of R&D Acceleration at PDF Solutions; a... » read more

How Secure Is Your Face?

By Yuri Nagano - 07 Nov, 2019 - Comments: 0

Biometric security, which spans everything from iris scans to fingerprint sensors, is undergoing the same kind of race against hackers as every other type of sensor. While most of these systems work well enough to identify a person, there are a number of well-known ways to defeat them. One is simply to apply newer technology to cracking algorithms used inside these devices. Improvements in p... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: U.S. Dept. of Commerce

Money Pours Into New Fabs And Facilities

Data, System Reliability, and Privacy

How Secure Is Your Face?

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