Grappling With Smart City Security Issues

By John Koon - 02 Sep, 2021 - Comments: 0

Security concerns are rising as cities seek to modernize services by connecting them to the internet and to each other, creating a widening attack surface that is a potential target for everything from disruption of services to ransomware demands. The goal of smart cities is to apply technology and intelligence to a variety of services to enable independent operation, real-time response, as ... » read more

IIoT Security Threat Rising

By Kevin Fogarty - 14 Mar, 2018 - Comments: 0

The rapid growth of the Industrial Internet of Things is raising questions about just how secure these systems are today, how to improve security, and who exactly should be responsible for that. These issues are interlaced with a shift in where a growing volume of data gets processed, the cost and speed of moving large amounts of data, and the increasing frequency and cost of attacks. "Di... » read more

Imperfect Silicon, Near-Perfect Security

By Kevin Fogarty - 07 Feb, 2018 - Comments: 0

Some chipmakers, under pressure to add security to rapidly growing numbers of IoT devices, have rediscovered a "fingerprinting" technique used primarily as an anti-counterfeiting measure. [getkc id="227" kc_name="Physically unclonable functions"] (PUFs) are used to assign a unique identification number based on inconsistencies in the speed with which current causes a series of logic gates to... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: U.S. Dept. of Homeland Security

Grappling With Smart City Security Issues

IIoT Security Threat Rising

Imperfect Silicon, Near-Perfect Security