Week In Review: Semiconductor Manufacturing, Test

By Susan Rambo - 04 Aug, 2023 - Comments: 0

China’s restrictions on the export gallium and germanium took effect this week. Any Chinese company exporting gallium or germanium that could be used in military and civil applications (dual-use) must obtain a license from China’s Ministry of Commerce. China produces 60% of the worldwide supply of germanium and 80% of the world’s gallium, both of which have to be processed from other mate... » read more

Week in Review – IoT, Security, Autos

By Jeff Dorsch - 20 Sep, 2019 - Comments: 0

Products/Services Synopsys had a lot of announcements this week! Summer is definitely over. The company released BSIMM10 study, the latest version of the Building Security in Maturity Model, helping organizations plan, execute, mature, and measure their software security initiatives. It also released LucidShape version 2019.09, the latest version of that tool for the design, simulation, and an... » read more

U.S. Senate Report On The Equifax Breach

By Technical Paper Link - 22 Jun, 2019 - Comments: 0

Source: U.S. Senate, Permanent Subcommittee On Investigations Committee on Homeland Security and Governmental Affairs Here's the link to the U.S. Senate report on the Equifax breach » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 03 May, 2019 - Comments: 0

Internet of Things AT&T reports the activation of its narrowband Internet of Things network in the U.S. The carrier upgraded its 4G LTE cell sites across the country. It now offers two low-power wide-area networks to business customers, including its LTE-M network in Mexico and the U.S. “Both networks are designed for the IoT within licensed spectrum and provide carrier-grade security,�... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 05 Apr, 2019 - Comments: 0

Internet of Things Microsoft has new services and capabilities for Azure-connected Internet of Things devices. There’s a new IoT security tool called Azure Security Center for IoT, which ties in with other tools within Azure IoT Hub. Azure Security Center for IoT uses Azure Security Center, Microsoft’s threat intelligence offering. The new IoT security tool also hooks into Azure Sentinel, ... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 07 Dec, 2018 - Comments: 0

Internet of Things DHL Supply Chain reports that it will spend $300 million to install Internet of Things sensors and collaborative robots in its North American warehouses, bringing 60% of those facilities up to automation capabilities already implemented in 85 of DHL’s 430 warehouses in North America. The company will also employ robotic process automation software and other programs to red... » read more

The Week In Review: IoT

By Jeff Dorsch - 11 Aug, 2017 - Comments: 0

Connectivity M1 Limited of Singapore worked with Nokia to launch a nationwide narrowband Internet of Things network, targeting such applications as asset tracking, environmental monitoring, fleet management, and smart energy management for buildings. M1 hopes to boost the IoT ecosystem in Singapore with the new NB-IoT network. M&A DuPont has agreed to acquire Granular, a provider of digita... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 10 Jul, 2015 - Comments: 0

An alliance led by IBM Research has produced the semiconductor industry’s first 7nm test chips with functioning transistors. The breakthrough, accomplished in partnership with GlobalFoundries and Samsung at SUNY Polytechnic Institute’s Colleges of Nanoscale Science and Engineering, could result in the ability to place more than 20 billion tiny switches, or transistors, on a chip. There i... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: U.S. Senate

Week In Review: Semiconductor Manufacturing, Test

Week in Review – IoT, Security, Autos

U.S. Senate Report On The Equifax Breach

Week in Review: IoT, Security, Auto

Week in Review: IoT, Security, Auto

Week in Review: IoT, Security, Auto

The Week In Review: IoT

The Week In Review: Manufacturing