tag: Ultratech

Variation’s Long, Twisty Tail Worsens At 7/5nm
By Ed Sperling - 20 Sep, 2018 - Comments: 1

Variation is becoming a bigger challenge at each new node, but not just for obvious reasons and not always from the usual sources. Nevertheless, dealing with these issues takes additional time and resources, and it can affect the performance and reliability of those chips throughout their lifetimes. At a high level, variation historically was viewed as a mismatch between what design teams in... » read more

Litho Options For Panel Fan-out
By Mark LaPedus - 06 Nov, 2017 - Comments: 2

Several packaging houses are inching closer to production of panel-level fan-out packaging, a next-generation technology that promises to reduce the cost of today’s fan-out packages. In fact, ASE, Nepes, Samsung and others already have installed the equipment in their panel-level fan-out lines with production slated for 2018 or so. But behind the scenes, panel-level packaging houses contin... » read more

Challenges For Future Fan-Outs
By Mark LaPedus - 07 Jul, 2017 - Comments: 1

The fan-out wafer-level packaging market is heating up. At the high end, for example, several packaging houses are developing new fan-out packages that could reach a new milestone and hit or break the magic 1µm line/space barrier. But the technology presents some challenges, as it may require more expensive process flows and equipment like lithography. Fig. 1: Redistribution layers. Source: L... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 03 Feb, 2017 - Comments: 0

Manufacturing Veeco Instruments has signed a definitive agreement to acquire Ultratech. With the deal, Veeco will enter into the lithography market for chip-packaging as well as the laser spike anneal business. Veeco is a supplier of MOCVD tools. The implied total transaction value is approximately $815 million and the implied enterprise value is approximately $550 million. FlexTech, a SE... » read more

Building Faster Chips
By Ed Sperling - 21 Jul, 2016 - Comments: 5

By Ed Sperling and Jeff Dorsch An explosion in IoT sensor data, the onset of deep learning and AI, and the commercial rollout of augmented and virtual reality are driving a renewed interest in performance as the key metric for semiconductor design. Throughout the past decade in which mobility/smartphone dominated chip design, power replaced performance as the top driver. Processors ha... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 24 Jun, 2016 - Comments: 0

Manufacturing United States President Barack Obama has announced the winner of the New Smart Manufacturing Innovation Institute and manufacturing hub competition. The winner is the Smart Manufacturing Leadership Coalition (SMLC). This coalition, headquartered in Los Angeles, Calif., brings together a consortium of nearly 200 partners from across academia, industry and non-profits. The idea is... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 10 Jun, 2016 - Comments: 0

MEMS manufacturing A*STAR’s Institute of Microelectronics (IME) in Singapore has launched its third consortium to develop MEMS technologies. This would allow MEMS sensor devices to achieve better performance, higher power efficiency and a smaller form factor. The MEMS Consortium III consists of the following companies: Applied Materials, Coventor, Delta Electronics, GlobalFoundries, InvenS... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 29 Apr, 2016 - Comments: 0

Chipmakers IC Insights released its foundry rankings in terms of sales in 2015. TSMC was the leader with $26.4 billion in sales last year. Second ranked GlobalFoundries, which took over IBM’s IC business in 2015, made some gains. With IBM’s chip unit, GlobalFoundries’ quarterly sales in 4Q ‘15 were about $1.4 billion, an annual run-rate of $5.6 billion, about 12% greater than the compa... » read more

Fab Tool Biz Looks Cloudy
By Mark LaPedus - 17 Dec, 2015 - Comments: 1

Amid a slowdown in the foundry and DRAM sectors, the outlook for the semiconductor equipment industry looks somewhat cloudy, if not challenging, in 2016. In fact, for equipment vendors, 2016 could resemble the lackluster year in 2015. In 2015, for example, capital spending in the foundry sector fell during the year, although NAND flash began to pick up steam. In 2015, though, the big stor... » read more

China’s Fab Tool Biz Heats Up
By Mark LaPedus - 28 Oct, 2015 - Comments: 0

For years, China has been a steady growth market for suppliers of semiconductor equipment. Internally, though, the country is comprised of trailing-edge fabs and IC-assembly houses, which means equipment vendors sell relatively mature tools and compete on price. That’s about to change, however. Today, the IC equipment business is heating up in China as the nation begins to upgrade and pour... » read more

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