Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 23 Jul, 2021 - Comments: 0

Security Xilinx is investing an undisclosed amount in fabless semiconductor startup Kameleon Security, which is working on a cyber protection chip for servers, data centers, and cloud computing. The proactive Security Processing Unit (ProSPU) already secures the boot and has a root of trust (RoT). The chip will be demonstrated at the Open Compute Project (OCP) Global Summit, which is planned f... » read more

IoT Security: Confusing And Fragmented

By Bryon Moyer - 01 Jul, 2021 - Comments: 0

Security regulations for Internet-of-Things (IoT) devices are evolving around the world, but there is no consistent set of requirements that can be applied globally — and there may never be. What exists today is a patchwork of certification labs and logos. That makes it difficult for IoT-device designers to know where to get their security blessed. Unlike in data centers, where there is a ... » read more

Security Becomes A Multi-System Issue

By Ed Sperling - 27 Oct, 2016 - Comments: 0

The fallout from the Mirai malware attack last week was surprising, given that it was published on the Internet several months ago as open-source. Despite numerous warnings, it still managed to cause denial of service attacks at Amazon, Netflix, and a slew of other companies that are supposed to be able to fend off these kinds of attacks. The good news is that it more people talking about th... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Underwriters Laboratories

Week In Review: Auto, Security, Pervasive Computing

IoT Security: Confusing And Fragmented

Security Becomes A Multi-System Issue