The Week In Review: Manufacturing

By Mark LaPedus - 22 Dec, 2017 - Comments: 0

Chipmakers, LCD suppliers United Microelectronics Corp. (UMC) has announced the availability of the company’s 40nm process platform that incorporates Silicon Storage Technology’s (SST) embedded SuperFlash non-volatile memory. The 40nm SST process features a >20% reduction in eFlash cell size and 20-30% macro area over UMC’s 55nm SST technology. Toshiba Electronic Devices & Storage has s... » read more

Whither Xcerra?

By Jeff Dorsch - 11 Sep, 2017 - Comments: 0

Trade tensions between the People’s Republic of China and the Trump Administration could sink a big transaction in the automatic test equipment business. Xcerra, a supplier of semiconductor test systems, board testers, and electronic interconnects, announced in April that it had accepted an offer from Unic Capital Management, an affiliate of Sino IC Capital, to acquire the company for $10.... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 08 Sep, 2017 - Comments: 1

Chipmakers Toshiba is still looking for a buyer for its prized NAND flash memory business. The leading contenders for the business are a consortium with Western Digital. Meanwhile, Toshiba’s memory unit is expanding its Fab 6 facility at its Yokkaichi Operations, based in Japan. And now, it has selected a site for its next fab in Japan, this time in Kitakami City, Iwate. Construction is expe... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 18 Aug, 2017 - Comments: 2

Chipmakers Taiwan on Tuesday suffered a blackout after an accident occurred at a gas-fired plant, according to a report from Bloomberg. The outage, which lasted from 5 p.m. to 10 p.m., impacted more than 6 million homes and disrupted some IC production on the island, according to the report. Taiwan’s president was criticized for the event, as the government plans to shutter the island’s nu... » read more

Time For Massively Parallel Testing

By Jeff Dorsch - 12 Apr, 2017 - Comments: 0

Time is money in electronics, as in other industries, and the more time that is invested in testing chips means more costs being added to the product in question. To speed up testing for memory devices and other semiconductors, test equipment vendors have resorted to parallel testing technology, simultaneously testing multiple chips at a time. The industry also is turning to system-level tes... » read more

Knowledge Centers
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Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

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Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

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eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

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tag: Unic Capital Management

The Week In Review: Manufacturing

Whither Xcerra?

The Week In Review: Manufacturing

The Week In Review: Manufacturing

Time For Massively Parallel Testing