Chip Industry Week in Review


To listen to the podcast version, click here. TSMC unveiled an unusually detailed roadmap at this week's North America Technology Symposium, including future architectures for 3D-ICs for high-performance computing and small, extremely low-power chips for AR/VR glasses, and two implementations of system-on-wafer. Fig. 1: TSMC's future packaging and stacking roadmap. Source: TSMC The ... » read more

Week In Review: Auto, Security, Pervasive Computing


Hyundai, Samsung Catalyst Fund, and others invested a combined $100 million in Canada-based Tenstorrent to accelerate the design and development of AI chiplets and machine-learning software and allow the integration of AI into future Hyundai, Kia, and Genesis vehicles, plus other future mobilities such as robotics and advanced air mobility (AAM). The National Highway Traffic Safety Administr... » read more

Chip Industry’s Technical Paper Roundup: August 1


New technical papers recently added to Semiconductor Engineering’s library: [table id=39 /] More Reading Technical Paper Library home » read more

Automotive Lidar: Softening The Trade-off Between Ambiguity Range And Speed 


A technical paper titled “Overcoming the limitations of 3D sensors with wide field of view metasurface-enhanced scanning lidar” was published by researchers at Université Côte d’Azur and CRHEA. Abstract: "Lidar, a technology at the heart of autonomous driving and robotic mobility, performs 3D imaging of a complex scene by measuring the time of flight of returning light p... » read more