Week In Review: Auto, Security, Pervasive Computing

By Liz Allan - 04 Aug, 2023 - Comments: 0

Hyundai, Samsung Catalyst Fund, and others invested a combined $100 million in Canada-based Tenstorrent to accelerate the design and development of AI chiplets and machine-learning software and allow the integration of AI into future Hyundai, Kia, and Genesis vehicles, plus other future mobilities such as robotics and advanced air mobility (AAM). The National Highway Traffic Safety Administr... » read more

Chip Industry’s Technical Paper Roundup: August 1

By Liz Allan - 01 Aug, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=39 /] More Reading Technical Paper Library home » read more

Automotive Lidar: Softening The Trade-off Between Ambiguity Range And Speed

By Technical Paper Link - 28 Jul, 2023 - Comments: 0

A technical paper titled “Overcoming the limitations of 3D sensors with wide field of view metasurface-enhanced scanning lidar” was published by researchers at Université Côte d’Azur and CRHEA. Abstract: "Lidar, a technology at the heart of autonomous driving and robotic mobility, performs 3D imaging of a complex scene by measuring the time of flight of returning light p... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Université Côte d’Azur

Week In Review: Auto, Security, Pervasive Computing

Chip Industry’s Technical Paper Roundup: August 1

Automotive Lidar: Softening The Trade-off Between Ambiguity Range And Speed

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