Partitioning decisions for 3D-ICs; automotive lidar; Si photonics; carbon nanotube PUFs; graphene on SiC; 1024-core RISC-V processors; RISC-V for next-gen automotive; virtual wafer process modeling and metrology.
New technical papers recently added to Semiconductor Engineering’s library:
| Technical Paper | Research Organizations |
|---|---|
| Impact of gate-level clustering on automated system partitioning of 3D-ICs | Université libre de Bruxelles and imec |
| Overcoming the limitations of 3D sensors with wide field of view metasurface-enhanced scanning lidar | Université Côte d’Azur and CRHEA |
| Unlocking the monolithic integration scenario: optical coupling between GaSb diode lasers epitaxially grown on patterned Si substrates and passive SiN waveguides | University of Montpellier, Tyndall National Institute, Munster Technological University and Polytechnic University of Bari |
| CNT-PUFs: Highly Robust and Heat-Tolerant Carbon-Nanotube-Based Physical Unclonable Functions for Stable Key Generation | Chemnitz University of Technology, University of Passau, Technical University of Darmstadt, and Fraunhofer Institute for Electronic Nano Systems (ENAS) |
| Direct synthesis of nanopatterned epitaxial graphene on silicon carbide | University of Technology Sydney, Ludwig-Maxilimians Universität München, Monash University, and Imperial College London |
| Fast Shared-Memory Barrier Synchronization for a 1024-Cores RISC-V Many-Core Cluster | ETH Zürich and Università di Bologna |
| Towards a RISC-V Open Platform for Next-generation Automotive ECUs | ETH Zurich and Huawei Research Center (Italy) |
| Review of virtual wafer process modeling and metrology for advanced technology development | Coventor Inc., Lam Research |
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