Week In Review: Auto, Security, Pervasive Computing

By Liz Allan - 04 Aug, 2023 - Comments: 0

Hyundai, Samsung Catalyst Fund, and others invested a combined $100 million in Canada-based Tenstorrent to accelerate the design and development of AI chiplets and machine-learning software and allow the integration of AI into future Hyundai, Kia, and Genesis vehicles, plus other future mobilities such as robotics and advanced air mobility (AAM). The National Highway Traffic Safety Administr... » read more

Chip Industry’s Technical Paper Roundup: August 1

By Liz Allan - 01 Aug, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=39 /] More Reading Technical Paper Library home » read more

RISC-V Open Platform for Next-Gen Automotive ECUs (ETH Zurich, Huawei)

By Technical Paper Link - 27 Jul, 2023 - Comments: 0

A technical paper titled “Towards a RISC-V Open Platform for Next-generation Automotive ECUs” was published by researchers at ETH Zurich and Huawei Research Center (Italy). Abstract: "The complexity of automotive systems is increasing quickly due to the integration of novel functionalities such as assisted or autonomous driving. However, increasing complexity poses considerable challenges... » read more

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Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

tag: Huawei Research Center

Week In Review: Auto, Security, Pervasive Computing

Chip Industry’s Technical Paper Roundup: August 1

RISC-V Open Platform for Next-Gen Automotive ECUs (ETH Zurich, Huawei)

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