tag: Université Libre de Bruxelles

Chip Industry Technical Paper Roundup: Dec. 3
By Linda Christensen - 03 Dec, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=391 /] » read more

STCO for Dense Edge Architectures using 3D Integration and NVM (imec,, et al.)
By Technical Paper Link - 27 Nov, 2024 - Comments: 0

A new technical paper titled "System-Technology Co-Optimization for Dense Edge Architectures using 3D Integration and Non-Volatile Memory" was published by researchers at imec, INESC-ID, Université Libre de Bruxelles, et al. "In this paper, we present an system-technology co-optimization (STCO) framework that interfaces with workload-driven system scaling challenges and physical design-enab... » read more

Chip Industry Technical Paper Roundup: July 30
By Linda Christensen - 30 Jul, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library, including a best paper award winner at ISCA. [table id=246 /] More ReadingTechnical Paper Library home » read more

CHERI RISC-V: HW Extension for Conditional Capabilities
By Technical Paper Link - 28 Jul, 2024 - Comments: 0

A technical paper titled “Mon CHÈRI <3 Adapting Capability Hardware Enhanced RISC with Conditional Capabilities” was published by researchers at Ericsson Security Research, Université Libre de Bruxelles, and KU Leuven. Abstract: "Up to 10% of memory-safety vulnerabilities in languages like C and C++ stem from uninitialized variables. This work addresses the prevalence and lack of ade... » read more

Week In Review: Semiconductor Manufacturing, Test
By Susan Rambo - 04 Aug, 2023 - Comments: 0

China’s restrictions on the export gallium and germanium took effect this week. Any Chinese company exporting gallium or germanium that could be used in military and civil applications (dual-use) must obtain a license from China’s Ministry of Commerce. China produces 60% of the worldwide supply of germanium and 80% of the world’s gallium, both of which have to be processed from other mate... » read more

Chip Industry’s Technical Paper Roundup: August 1
By Liz Allan - 01 Aug, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=39 /] More Reading Technical Paper Library home » read more

Impact of Clustering Methods On Partitioning Decisions For 3DICs (imec, Université libre de Bruxelles)
By Technical Paper Link - 28 Jul, 2023 - Comments: 0

A technical paper titled “Impact of gate-level clustering on automated system partitioning of 3D-ICs” was published by researchers at Université libre de Bruxelles and imec. Abstract: "When partitioning gate-level netlists using graphs, it is beneficial to cluster gates to reduce the order of the graph and preserve some characteristics of the circuit that the partitioning might degrade. ... » read more

Manufacturing Bits: Dec. 3
By Mark LaPedus - 03 Dec, 2019 - Comments: 0

Microscopic movie star Using a 3D printer and a scanning electron microscope (SEM), a group has created a short animated film featuring the world’s smallest 3D figurine. The stop motion film, called Stardust Odyssey, features a 3D human-like figurine with a height of 300 microns, or close to the size of a grain of dust. This beat the previous record for the smallest figure in a film. N... » read more

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy