Manufacturing Bits: Aug. 2

By Mark LaPedus - 02 Aug, 2016 - Comments: 0

CMP replacement? For years, chipmakers have used chemical-mechanical-polishing (CMP) tools to smooth or polish the surface of a wafer. CMP works, but the technology is time-consuming and expensive. CMP can also leave unwanted residual patterns and defects near the surface. In response, Russia’s National Research Nuclear University MEPhI (Moscow Engineering Physics Institute) has help... » read more

Manufacturing Bits: July 12

By Mark LaPedus - 12 Jul, 2016 - Comments: 0

Detecting zeptojoules Aalto University has broken the world’s record for microwave detection. Specifically, researchers detected zeptojoule microwave pulses using a superconducting microwave detector, based on proximity-induced Josephson junctions. This broke the record by fourteenfold, according to researchers. Microwaves are a form of electromagnetic radiation. They have frequencies... » read more

Manufacturing Bits: Sept. 8

By Mark LaPedus - 08 Sep, 2015 - Comments: 0

World’s pressure record The University of Bayreuth and the Deutsches Elektronen-Synchrotron (DESY) have set another world’s record for the highest static pressure ever achieved in a lab. Researchers were able to demonstrate metal osmium at pressures of up to 770 Gigapascals (GPa). Osmium is one of the world’s most incompressible metals. The 770 GPa figure is about 130 GPa higher than ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: University of Bayreuth

Manufacturing Bits: Aug. 2

Manufacturing Bits: July 12

Manufacturing Bits: Sept. 8